Inventor · disambiguated record
Prabhakar Subrahmanyam
Also filed as: SUBRAHMANYAM PRABHAKAR
10 granted patents·20 pending applications·15 citations·filing 2016–2024
80Inventor score
Top patents by PatentIndex Score
30 records- 0191US11439037B2Jet vectoring fluid impingement cooling using pivoting nozzlesINTEL CORP·Filed 2018·Granted Sep 6, 2022·11 cites·5 claims
- 0274US10930575B2Reconfigurable cooling assembly for integrated circuitryINTEL CORP·Filed 2016·Granted Feb 23, 2021·3 cites·25 claims
- 0371US12500137B2Directly impinging pressure modulated spray cooling and methods of target temperature controlINTEL CORP·Filed 2023·Granted Dec 16, 2025·0 cites·5 claims
- 0461US2025014967A1Methods and apparatus to improve thermal dissipation and mechanical loading of integrated circuit packagesINTEL CORP·Filed 2024·Application pending·0 cites
- 0560US10973154B2Reconfigurable thermal control of high-powered integrated circuitryINTEL CORP·Filed 2016·Granted Apr 6, 2021·1 cites·17 claims
- 0660US2025024593A1Apparatus and systems to retain a printed circuit board between mounting platesGENG PHIL·Filed 2024·Application pending·0 cites
- 0759US2025123887A1Systems, apparatus, and methods for energy harvesting in data centersINTEL CORP·Filed 2024·Application pending·0 cites
- 0858US12442712B2Liquid cooling system leak detection improvementsINTEL CORP·Filed 2020·Granted Oct 14, 2025·0 cites·15 claims
- 0958US11917790B2Thermal control for processor-based devicesINTEL CORP·Filed 2020·Granted Feb 27, 2024·0 cites·22 claims
- 1058US2025393169A1Electronic control unit and method of manufacturing an electronic control unitINTEL CORP·Filed 2024·Application pending·0 cites
- 1158US2024365513A1Optimized and automated dynamic thermal regulation method and apparatus with self-tuning two-phase cooling systemINTEL CORP·Filed 2023·Application pending·0 cites
- 1256US12169180B2Optical leak detection of liquid cooling components within an electronic systemINTEL CORP·Filed 2020·Granted Dec 17, 2024·0 cites·20 claims
- 1355US2024276675A1Methods and apparatus to mitigate hotspots in integrated circuit packages using gimbaling nozzles and jet vectoring impingementINTEL CORP·Filed 2024·Application pending·0 cites
- 1454US2021351106A1Directly impinging pressure modulated spray cooling and methods of target temperature controlINTEL CORP·Filed 2020·Application pending·0 cites
- 1553US2024240688A1Mitigation of seismic event effects on liquid immersion cooling systemsGENG PHIL·Filed 2024·Application pending·0 cites
- 1652US2025053221A1Methods and apparatus to save power based on user presenceINTEL CORP·Filed 2024·Application pending·0 cites
- 1750US12424513B2Technologies for isolated heat dissipating devicesINTEL CORP·Filed 2021·Granted Sep 23, 2025·0 cites·19 claims
- 1850US12213288B2Self cooling adaptive flow branching heat exchanger system for cooling of one or more semiconductor chipsINTEL CORP·Filed 2020·Granted Jan 28, 2025·0 cites·21 claims
- 1950US2024029539A1Methods, systems, apparatus, and articles of manufacture to monitor heat exchangers and associated reservoirsINTEL CORP·Filed 2023·Application pending·0 cites
- 2050US2023422389A1Cold plates for secondary side components of printed circuit boardsINTEL CORP·Filed 2023·Application pending·0 cites
- 2150US2025217010A1Intelligent sensing of screen content updates for user context processingMANEPALLI SANGEETA·Filed 2023·Application pending·0 cites
- 2250US2025207608A1Apparatus for reducing air turbulence in a fan chassisINTEL CORP·Filed 2023·Application pending·0 cites
- 2349US2024126354A1Power budgeting for computer peripheralsINTEL CORP·Filed 2023·Application pending·0 cites
- 2449US2023345677A1Compact rear mounted heat exchangers and related methodsINTEL CORP·Filed 2023·Application pending·0 cites
- 2547US2024244800A1Hybrid cooler to thermally cool semiconductor devices inside and outside a chip packageINTEL CORP·Filed 2021·Application pending·0 cites
- 2647US2022173015A1Liquid cooled cold plate for multiple semiconductor chip packagesINTEL CORP·Filed 2022·Application pending·0 cites
- 2746US12464678B2Self-healing, target temperature load balancing, and related technologies for heat exchanger networksINTEL CORP·Filed 2021·Granted Nov 4, 2025·0 cites·22 claims
- 2842US2022117112A1Enhanced electronic package thermal dissipation with in-situ transpiration cooling and reduced thermal interstitial resistanceINTEL CORP·Filed 2020·Application pending·0 cites
- 2941US2023016098A1Field replaceable fan assemblies for peripheral processing units and related systems and methodsINTEL CORP·Filed 2022·Application pending·0 cites
- 3040US2022225542A1Thin form factor assemblies for cooling dimmsINTEL CORP·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →