Inventor · disambiguated record
Paul Diglio
Also filed as: DIGLIO PAUL · DIGLIO PAUL J · DIGLIO PAUL JONATHAN
22 granted patents·11 pending applications·22 citations·filing 2012–2024
90Inventor score
Top patents by PatentIndex Score
33 records- 0191US11808988B2Method and device for fast, passive alignment in photonics assemblyINTEL CORP·Filed 2021·Granted Nov 7, 2023·2 cites·20 claims
- 0288US12057370B2Vacuum modulated two phase cooling loop efficiency and parallelism enhancementINTEL CORP·Filed 2020·Granted Aug 6, 2024·2 cites·13 claims
- 0384US9377486B2Thermal interface material handling for thermal control of an electronic component under testSONG DAVID WON-JUN·Filed 2014·Granted Jun 28, 2016·11 cites·16 claims
- 0480US9791501B2Compliant thermal contact device and methodINTEL CORP·Filed 2012·Granted Oct 17, 2017·4 cites·15 claims
- 0577US12493151B2Method and device for fast, passive alignment in photonics assemblyINTEL CORP·Filed 2023·Granted Dec 9, 2025·0 cites·20 claims
- 0674US11073538B2Electrical testing apparatus with lateral movement of a probe support substrateINTEL CORP·Filed 2018·Granted Jul 27, 2021·1 cites·19 claims
- 0771US12500137B2Directly impinging pressure modulated spray cooling and methods of target temperature controlINTEL CORP·Filed 2023·Granted Dec 16, 2025·0 cites·5 claims
- 0868US11674980B2Low-profile gimbal platform for high-resolution in situ co-planarity adjustmentINTEL CORP·Filed 2020·Granted Jun 13, 2023·0 cites·20 claims
- 0965US12411296B2Reworkable zero-force insertion electrical optical package socket and methodINTEL CORP·Filed 2021·Granted Sep 9, 2025·0 cites·23 claims
- 1065US12000487B2System and apparatus having a seal member for sealing of a device under testINTEL CORP·Filed 2022·Granted Jun 4, 2024·0 cites·20 claims
- 1163US11762157B2Method and system for attaching optical fibers to warped photonic chipsINTEL CORP·Filed 2021·Granted Sep 19, 2023·0 cites·20 claims
- 1262US9638747B2Placing integrated circuit devices using perturbationDIGLIO PAUL J·Filed 2013·Granted May 2, 2017·2 cites·20 claims
- 1359US2025216629A1Mechanical alignment features for glass waveguide to photonic integrated circuit matingINTEL CORP·Filed 2023·Application pending·0 cites
- 1459US2025291134A1Optical connectors with alignment featuresINTEL CORP·Filed 2024·Application pending·0 cites
- 1559US2025079262A1Methods and apparatus for multi-zone temperature control of jet impingement cooling of integrated circuit packagesINTEL CORP·Filed 2024·Application pending·0 cites
- 1657US10775414B2Low-profile gimbal platform for high-resolution in situ co-planarity adjustmentINTEL CORP·Filed 2017·Granted Sep 15, 2020·0 cites·16 claims
- 1756US12136577B2Integrated circuit die packages including a contiguous heat spreaderINTEL CORP·Filed 2020·Granted Nov 5, 2024·0 cites·22 claims
- 1855US2025208190A1Title direct fluid cooling with multi temperature controlINTEL CORP·Filed 2023·Application pending·0 cites
- 1954US12392818B2Enhanced jet impingement leak prevention for integrated circuitINTEL CORP·Filed 2022·Granted Aug 19, 2025·0 cites·17 claims
- 2054US12021016B2Thermally enhanced silicon back end layers for improved thermal performanceINTEL CORP·Filed 2020·Granted Jun 25, 2024·0 cites·16 claims
- 2154US11976671B2Vacuum modulated two phase cooling loop performance enhancementINTEL CORP·Filed 2020·Granted May 7, 2024·0 cites·14 claims
- 2254US2021351106A1Directly impinging pressure modulated spray cooling and methods of target temperature controlINTEL CORP·Filed 2020·Application pending·0 cites
- 2353US2023285999A1Dual feed cold spray nozzle with separate temperature and feeding rate controlINTEL CORP·Filed 2022·Application pending·0 cites
- 2452US11543454B2Double-beam test probeINTEL CORP·Filed 2018·Granted Jan 3, 2023·0 cites·24 claims
- 2552US2025208197A1Multi zone temperature control for devices under testINTEL CORP·Filed 2023·Application pending·0 cites
- 2651US12080620B2Additively manufactured structures for heat dissipation from integrated circuit devicesINTEL CORP·Filed 2020·Granted Sep 3, 2024·0 cites·21 claims
- 2751US10499461B2Thermal head with a thermal barrier for integrated circuit die processingINTEL CORP·Filed 2015·Granted Dec 3, 2019·0 cites·13 claims
- 2851US10393592B2Systems and methods for measuring surface temperatureINTEL CORP·Filed 2016·Granted Aug 27, 2019·0 cites·15 claims
- 2950US2023314733A1Self-docking self-aligned optical pcb connector for semiconductor packagesINTEL CORP·Filed 2022·Application pending·0 cites
- 3048US2023095039A1Technologies for optical coupling to photonic integrated circuitsINTEL CORP·Filed 2021·Application pending·0 cites
- 3146US10030916B2Fluid flow channel for enhanced heat transfer efficiencyINTEL CORP·Filed 2014·Granted Jul 24, 2018·0 cites·12 claims
- 3245US2024328512A1Methods and apparatus to reduce leakage of cooling fluid used to cool an electronic componentINTEL CORP·Filed 2023·Application pending·0 cites
- 3334US2016377658A1Fluid flow in a temperature control actuator for semiconductor device testINTEL CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →