Inventor · disambiguated record
Daisuke Urayama
Also filed as: URAYAMA DAISUKE
3 granted patents·1 pending application·5 citations·filing 2013–2019
54Inventor score
Files withTOKYO ELECTRON LTD4
Top patents by PatentIndex Score
4 records- 0177US9660182B2Plasma processing method and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2013·Granted May 23, 2017·5 cites·8 claims
- 0256US10923329B2Substrate processing apparatus and substrate processing methodTOKYO ELECTRON LTD·Filed 2019·Granted Feb 16, 2021·0 cites·14 claims
- 0352US2015132970A1Substrate processing apparatus and substrate processing methodTOKYO ELECTRON LTD·Filed 2013·Application pending·0 cites
- 0441US10825688B2Method for etching copper layerTOKYO ELECTRON LTD·Filed 2017·Granted Nov 3, 2020·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →