Inventor · disambiguated record
Dario Vitello
Also filed as: VITELLO DARIO
6 granted patents·6 pending applications·3 citations·filing 2016–2025
68Inventor score
Technology areasH10W
Top patents by PatentIndex Score
12 records- 0191US11721614B2Method of manufacturing semiconductor devices and corresponding semiconductor device having vias and pads formed by laserST MICROELECTRONICS SRL·Filed 2020·Granted Aug 8, 2023·3 cites·18 claims
- 0267US12424521B2Method of manufacturing semiconductor devices and corresponding semiconductor device having vias and pads formed by laserST MICROELECTRONICS SRL·Filed 2023·Granted Sep 23, 2025·0 cites·16 claims
- 0356US12211763B2Enhanced thermal dissipation in flip-chip semiconductor devices using laser direct structuring (LDS) technologyST MICROELECTRONICS SRL·Filed 2021·Granted Jan 28, 2025·0 cites·13 claims
- 0452US2024038636A1Method of manufacturing semiconductor devices, corresponding substrate and semiconductor deviceST MICROELECTRONICS SRL·Filed 2023·Application pending·0 cites
- 0551US12500148B2Method of coupling semiconductor dice, tool for use therein and corresponding semiconductor deviceST MICROELECTRONICS SRL·Filed 2022·Granted Dec 16, 2025·0 cites·13 claims
- 0648US2022238473A1Method of manufacturing semiconductor devices and corresponding semiconductor deviceST MICROELECTRONICS SRL·Filed 2022·Application pending·0 cites
- 0746US2025167058A1Enhanched thermal dissipation in flip-chip semiconductor devices using laser direct (lds) structuring technologyST MICROELECTRONICS SRL·Filed 2025·Application pending·0 cites
- 0846US2023360928A1Method for manufacturing semiconductor devices and corresponding semiconductor deviceST MICROELECTRONICS SRL·Filed 2023·Application pending·0 cites
- 0942US10763192B2Method of manufacturing semiconductor devices and corresponding semiconductor deviceST MICROELECTRONICS SRL·Filed 2018·Granted Sep 1, 2020·0 cites·17 claims
- 1039US2025273540A1Method of manufacturing semiconductor devices and corresponding semiconductor deviceST MICROELECTRONICS INT NV·Filed 2025·Application pending·0 cites
- 1135US2019181076A1Method of manufacturing leadframes of semiconductor devices,corresponding leadframe and semiconductor deviceST MICROELECTRONICS SRL·Filed 2018·Application pending·0 cites
- 1222US9922947B2Bonding pad structure over active circuitryST MICROELECTRONICS SRL·Filed 2016·Granted Mar 20, 2018·0 cites·22 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →