Inventor · disambiguated record
Daniel J. Zierath
Also filed as: ZIERATH DANIEL · ZIERATH DANIEL J
8 granted patents·12 pending applications·58 citations·filing 2003–2018
84Inventor score
Top patents by PatentIndex Score
20 records- 0195US9514983B2Cobalt based interconnects and methods of fabrication thereofJEZEWSKI CHRISTOPHER J·Filed 2012·Granted Dec 6, 2016·32 cites·19 claims
- 0279US9123706B2Electroless filled conductive structuresZIERATH DANIEL J·Filed 2011·Granted Sep 1, 2015·7 cites·18 claims
- 0379US8779589B2Liner layers for metal interconnectsSIMKA HARSONO S·Filed 2010·Granted Jul 15, 2014·8 cites·21 claims
- 0467US11018054B2Integrated circuit interconnectsINTEL CORP·Filed 2017·Granted May 25, 2021·1 cites·19 claims
- 0564US7279084B2Apparatus having plating solution container with current applying anodesINTEL CORP·Filed 2004·Granted Oct 9, 2007·7 cites·6 claims
- 0663US7371311B2Modified electroplating solution components in a low-acid electrolyte solutionINTEL CORP·Filed 2003·Granted May 13, 2008·3 cites·7 claims
- 0759US10651082B2Diffusion barriersINTEL CORP·Filed 2016·Granted May 12, 2020·0 cites·25 claims
- 0857US2006006071A1Method for improving electroplating in sub-0.1um interconnects by adjusting immersion conditionsCHE GUANGLI·Filed 2005·Application pending·0 cites
- 0954US2005274619A1Modified electroplating solution components in a low-acid electrolyte solutionZIERATH DANIEL J·Filed 2005·Application pending·0 cites
- 1050US11769729B2Metal structures, devices, and methodsINTEL CORP·Filed 2018·Granted Sep 26, 2023·0 cites·20 claims
- 1149US2012258588A1Self forming metal fluoride barriers for fluorinated low-k dielectricsJEZEWSKI CHRISTOPHER J·Filed 2012·Application pending·0 cites
- 1247US2004245107A1Method for improving electroplating in sub-0.1um interconnects by adjusting immersion conditionsFiled 2003·Application pending·0 cites
- 1346US2010244252A1Self Forming Metal Fluoride Barriers for Fluorinated Low-K DielectricsJEZEWSKI CHRISTOPHER J·Filed 2009·Application pending·0 cites
- 1446US2006091018A1Methods for reducing protrusions and within die thickness variations on plated thin filmCAO YANG·Filed 2005·Application pending·0 cites
- 1543US2015371949A1Electroless filled conductive structuresINTEL CORP·Filed 2015·Application pending·0 cites
- 1641US2008113508A1Method of fabricating metal interconnects using a sacrificial layer to protect seed layer prior to gap fillAKOLKAR ROHAN N·Filed 2006·Application pending·0 cites
- 1739US2004188265A1Methods for reducing protrusions and within die thickness variations on plated thin filmFiled 2003·Application pending·0 cites
- 1835US2012153483A1Barrierless single-phase interconnectAKOLKAR ROHAN N·Filed 2010·Application pending·0 cites
- 1931US2021167019A1Metal interconnects, devices, and methodsINTEL CORP·Filed 2017·Application pending·0 cites
- 2031US2005077180A1Modified electroplating solution components in a high-acid electrolyte solutionFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →