Inventor · disambiguated record
David Zoba
Also filed as: ZOBA DAVID · ZOBA DAVID A
3 granted patents·3 pending applications·478 citations·filing 2000–2010
80Inventor score
Top patents by PatentIndex Score
6 records- 0197US6472758B1Semiconductor package including stacked semiconductor dies and bond wiresAMKOR TECHNOLOGY INC·Filed 2000·Granted Oct 29, 2002·193 cites·27 claims
- 0296US6650019B2Method of making a semiconductor package including stacked semiconductor diesAMKOR TECHNOLOGY INC·Filed 2002·Granted Nov 18, 2003·123 cites·27 claims
- 0395US6603072B1Making leadframe semiconductor packages with stacked dies and interconnecting interposerAMKOR TECHNOLOGY INC·Filed 2001·Granted Aug 5, 2003·162 cites·33 claims
- 0456US2008063873A1Flexible microelectronics adhesiveSTAPLETON RUSSELL·Filed 2007·Application pending·0 cites
- 0550US2010219526A1Flexible microelectronics adhesiveSTAPLETON RUSSELL·Filed 2010·Application pending·0 cites
- 0633US2005156322A1Thin semiconductor package including stacked diesFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →