Inventor · disambiguated record
Deog Soon Choi
Also filed as: CHOI DEOG SOON
18 granted patents·5 pending applications·23 citations·filing 2014–2019
90Inventor score
Top patents by PatentIndex Score
23 records- 0187US9693445B2Printed circuit board with thermal viaAVAGO TECHNOLOGIES GENERAL IP·Filed 2015·Granted Jun 27, 2017·7 cites·21 claims
- 0280US10134682B2Circuit package with segmented external shield to provide internal shielding between electronic componentsAVAGO TECHNOLOGIES GENERAL IP·Filed 2015·Granted Nov 20, 2018·4 cites·15 claims
- 0380US9972590B2Semiconductor package having a solder-on-pad structureAVAGO TECHNOLOGIES GENERAL IP·Filed 2016·Granted May 15, 2018·4 cites·20 claims
- 0470US10141268B2Circuit package with internal and external shieldingAVAGO TECHNOLOGIES GENERAL IP·Filed 2015·Granted Nov 27, 2018·2 cites·20 claims
- 0570US10134686B2Systems and methods for providing electromagnetic interference (EMI) compartment shielding for components disposed inside of system electronic packagesAVAGO TECHNOLOGIES GENERAL IP·Filed 2017·Granted Nov 20, 2018·1 cites·21 claims
- 0668US10285258B2Systems and methods for providing electromagnetic interference (EMI) compartment shielding for components disposed inside of system electronic packagesAVAGO TECHNOLOGIES GENERAL IP·Filed 2018·Granted May 7, 2019·1 cites·20 claims
- 0766US10264666B2Method of providing compartment EMI shields on printed circuit board using a vacuumAVAGO TECHNOLOGIES GENERAL IP·Filed 2016·Granted Apr 16, 2019·1 cites·20 claims
- 0866US10076023B2Systems and methods for providing electromagnetic interference (EMI) compartment shielding for components disposed inside of system electronic packagesAVAGO TECHNOLOGIES GENERAL IP·Filed 2016·Granted Sep 11, 2018·1 cites·33 claims
- 0961US10163808B2Module with embedded side shield structures and method of fabricating the sameAVAGO TECHNOLOGIES GENERAL IP·Filed 2015·Granted Dec 25, 2018·1 cites·10 claims
- 1059US10468356B2Systems and methods for providing electromagnetic interference (EMI) compartment shielding for components disposed inside of system electronic packagesAVAGO TECH INT SALES PTE LID·Filed 2019·Granted Nov 5, 2019·0 cites·20 claims
- 1159US9974181B2Module with external shield and back-spill barrier for protecting contact padsAVAGO TECHNOLOGIES GENERAL IP·Filed 2016·Granted May 15, 2018·1 cites·20 claims
- 1257US10477673B2Systems and methods for providing electromagnetic interference (EMI) compartment shielding for components disposed inside of system electronic packagesAVAGO TECH INT SALES PTE LID·Filed 2019·Granted Nov 12, 2019·0 cites·21 claims
- 1357US10229888B2Systems and methods for providing electromagnetic interference (EMI) compartment shielding for components disposed inside of system electronic packagesAVAGO TECHNOLOGIES GENERAL IP·Filed 2018·Granted Mar 12, 2019·0 cites·19 claims
- 1449US9192048B1Bonding pad for printed circuit board and semiconductor chip package using sameAVAGO TECHNOLOGIES GENERAL IP·Filed 2014·Granted Nov 17, 2015·0 cites·32 claims
- 1541US2020043821A1Electronic assembly and a method of forming thereofAVAGO TECH INT SALES PTE LID·Filed 2018·Application pending·0 cites
- 1640US10271421B2Systems and methods for providing electromagnetic interference (EMI) shielding between inductors of a radio frequency (RF) moduleAVAGO TECHNOLOGIES GENERAL IP·Filed 2017·Granted Apr 23, 2019·0 cites·17 claims
- 1740US10178757B2Systems and methods for providing electromagnetic interference (EMI) compartment shielding for components disposed inside of system electronic packagesAVAGO TECHNOLOGIES GENERAL IP·Filed 2017·Granted Jan 8, 2019·0 cites·20 claims
- 1839US9972592B2Bumped land grid arrayAVAGO TECHNOLOGIES GENERAL IP·Filed 2016·Granted May 15, 2018·0 cites·20 claims
- 1937US9907169B1Printed circuit board (PCB) and PCB assembly having an encapsulating mold material on a bottom surface thereof and methods for molding an encapsulating mold material on a bottom surface of a PCBAVAGO TECHNOLOGIES GENERAL IP·Filed 2016·Granted Feb 27, 2018·0 cites·22 claims
- 2033US2017062352A1Semiconductor chip moduleAVAGO TECHNOLOGIES GENERAL IP·Filed 2015·Application pending·0 cites
- 2133US2017117229A1Circuit package with trench features to provide internal shielding between electronic componentsAVAGO TECHNOLOGIES GENERAL IP·Filed 2015·Application pending·0 cites
- 2232US2016204077A1Method for manufacturing electronic device by using flip-chip bondingAVAGO TECHNOLOGIES GENERAL IP·Filed 2015·Application pending·0 cites
- 2332US2017118877A1Circuit package with bond wires to provide internal shielding between electronic componentsAVAGO TECHNOLOGIES GENERAL IP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →