Inventor · disambiguated record
Dennis Cong
Also filed as: CONG DENNIS
1 granted patent·1 pending application·62 citations·filing 1999–2001
52Inventor score
Technology areasH10W
Files withAPPLIED MATERIALS INC1
Top patents by PatentIndex Score
2 records- 0181US6362099B1Method for enhancing the adhesion of copper deposited by chemical vapor depositionAPPLIED MATERIALS INC·Filed 1999·Granted Mar 26, 2002·62 cites·3 claims
- 0234US2002119657A1Method for enhancing the adhesion of copper deposited by chemical vapor depositionFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →