Inventor · disambiguated record
Derya Deniz
Also filed as: DENIZ DERYA
16 granted patents·3 pending applications·476 citations·filing 2012–2024
91Inventor score
Top patents by PatentIndex Score
19 records- 0196US8889500B1Methods of forming stressed fin channel structures for FinFET semiconductor devicesGLOBALFOUNDRIES INC·Filed 2013·Granted Nov 18, 2014·28 cites·22 claims
- 0295US8859368B2Semiconductor device incorporating a multi-function layer into gate stacksDENIZ DERYA·Filed 2012·Granted Oct 14, 2014·413 cites·13 claims
- 0394US12365979B2Piezoelectric bulk layers with tilted c-axis orientation and methods for making the sameQORVO US INC·Filed 2023·Granted Jul 22, 2025·1 cites·20 claims
- 0490US8975142B2FinFET channel stress using tungsten contacts in raised epitaxial source and drainGLOBALFOUNDRIES INC·Filed 2013·Granted Mar 10, 2015·14 cites·16 claims
- 0583US11990885B2Method for manufacturing acoustic devices with improved performanceQORVO US INC·Filed 2021·Granted May 21, 2024·1 cites·20 claims
- 0683US9583397B1Source/drain terminal contact and method of forming sameGLOBALFOUNDRIES INC·Filed 2016·Granted Feb 28, 2017·5 cites·16 claims
- 0783US8912057B1Fabrication of nickel free silicide for semiconductor contact metallizationGLOBALFOUNDRIES INC·Filed 2013·Granted Dec 16, 2014·5 cites·12 claims
- 0882US8580686B1Silicidation and/or germanidation on SiGe or Ge by cosputtering Ni and Ge and using an intralayer for thermal stabilityDENIZ DERYA·Filed 2012·Granted Nov 12, 2013·7 cites·15 claims
- 0981US11885007B2Piezoelectric bulk layers with tilted c-axis orientation and methods for making the sameQORVO US INC·Filed 2022·Granted Jan 30, 2024·0 cites·20 claims
- 1080US12388407B2Method for manufacturing acoustic devices with improved performanceQORVO US INC·Filed 2024·Granted Aug 12, 2025·0 cites·15 claims
- 1176US11824511B2Method for manufacturing piezoelectric bulk layers with tilted c-axis orientationQORVO US INC·Filed 2019·Granted Nov 21, 2023·2 cites·20 claims
- 1261US12031949B2Preventing epoxy bleed-out for biosensor devicesQORVO US INC·Filed 2020·Granted Jul 9, 2024·0 cites·20 claims
- 1361US11401601B2Piezoelectric bulk layers with tilted c-axis orientation and methods for making the sameQORVO US INC·Filed 2019·Granted Aug 2, 2022·0 cites·14 claims
- 1457US11381212B2Piezoelectric bulk layers with tilted c-axis orientation and methods for making the sameQORVO US INC·Filed 2019·Granted Jul 5, 2022·0 cites·16 claims
- 1556US9076787B2Fabrication of nickel free silicide for semiconductor contact metallizationGLOBALFOUNDRIES INC·Filed 2014·Granted Jul 7, 2015·0 cites·9 claims
- 1648US2014361379A1Semiconductor device incorporating a multi-function layer into the gate stacksGLOBALFOUNDRIES INC·Filed 2014·Application pending·0 cites
- 1746US2023389430A1Methods for depositing piezoelectric materials, and materials deposited therewithQORVO BIOTECHNOLOGIES LLC·Filed 2021·Application pending·0 cites
- 1844US9117930B2Methods of forming stressed fin channel structures for FinFET semiconductor devicesGLOBALFOUNDRIES INC·Filed 2013·Granted Aug 25, 2015·0 cites·25 claims
- 1944US2023257869A1System for depositing piezoelectric materials, methods for using the same, and materials deposited with the sameQORVO BIOTECHNOLOGIES LLC·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →