Inventor · disambiguated record
Derek Gochnour
Also filed as: GOCHNOUR DEREK · GOCHNOUR DEREK J
89 granted patents·6 pending applications·3,372 citations·filing 1992–2022
99Inventor score
Files withMICRON TECHNOLOGY INC86SEMICONDUCTOR COMPONENTS IND LLC5MICRON DISPLAY TECH INC2FARNWORTH WARREN M1
Top patents by PatentIndex Score
95 records- 0199US6025728ASemiconductor package with wire bond protective memberMICRON TECHNOLOGY INC·Filed 1997·Granted Feb 15, 2000·230 cites·24 claims
- 0298US6578458B1Method for sawing wafers employing multiple indexing techniques for multiple die dimensionsMICRON TECHNOLOGY INC·Filed 2002·Granted Jun 17, 2003·106 cites·24 claims
- 0398US6300782B1System for testing semiconductor components having flexible interconnectMICRON TECHNOLOGY INC·Filed 2001·Granted Oct 9, 2001·111 cites·16 claims
- 0498US6263566B1Flexible semiconductor interconnect fabricated by backslide thinningMICRON TECHNOLOGY INC·Filed 1999·Granted Jul 24, 2001·141 cites·17 claims
- 0597US6242931B1Flexible semiconductor interconnect fabricated by backside thinningMICRON TECHNOLOGY INC·Filed 2001·Granted Jun 5, 2001·89 cites·14 claims
- 0696US6208157B1Method for testing semiconductor componentsMICRON TECHNOLOGY INC·Filed 1999·Granted Mar 27, 2001·120 cites·7 claims
- 0795US5962921AInterconnect having recessed contact members with penetrating blades for testing semiconductor dice and packages with contact bumpsMICRON TECHNOLOGY INC·Filed 1997·Granted Oct 5, 1999·157 cites·24 claims
- 0895US5893726ASemiconductor package with pre-fabricated cover and method of fabricationMICRON TECHNOLOGY INC·Filed 1997·Granted Apr 13, 1999·174 cites·23 claims
- 0994US6247629B1Wire bond monitoring system for layered packagesMICRON TECHNOLOGY INC·Filed 1999·Granted Jun 19, 2001·144 cites·9 claims
- 1094US6072326ASystem for testing semiconductor componentsMICRON TECHNOLOGY INC·Filed 1997·Granted Jun 6, 2000·102 cites·24 claims
- 1194US6040702ACarrier and system for testing bumped semiconductor componentsMICRON TECHNOLOGY INC·Filed 1997·Granted Mar 21, 2000·151 cites·31 claims
- 1292US6057597ASemiconductor package with pre-fabricated coverMICRON TECHNOLOGY INC·Filed 1998·Granted May 2, 2000·107 cites·27 claims
- 1392US5678301AMethod for forming an interconnect for testing unpackaged semiconductor diceMICRON TECHNOLOGY INC·Filed 1995·Granted Oct 21, 1997·111 cites·30 claims
- 1491US6553276B2Method of using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairsMICRON TECHNOLOGY INC·Filed 2002·Granted Apr 22, 2003·48 cites·35 claims
- 1591US6369595B1CSP BGA test socket with insert and methodMICRON TECHNOLOGY INC·Filed 1999·Granted Apr 9, 2002·55 cites·11 claims
- 1691US6025731AHybrid interconnect and system for testing semiconductor diceMICRON TECHNOLOGY INC·Filed 1997·Granted Feb 15, 2000·75 cites·23 claims
- 1790US9754983B1Chip scale package and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted Sep 5, 2017·6 cites·4 claims
- 1890US6555400B2Method for substrate mappingMICRON TECHNOLOGY INC·Filed 2001·Granted Apr 29, 2003·38 cites·12 claims
- 1990US6427676B2Method for sawing wafers employing multiple indexing techniques for multiple die dimensionsMICRON TECHNOLOGY INC·Filed 2001·Granted Aug 6, 2002·24 cites·18 claims
- 2090US5907492AMethod for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairsMICRON TECHNOLOGY INC·Filed 1997·Granted May 25, 1999·81 cites·26 claims
- 2189US6865086B2Apparatus and method to secure an adaptor to a reduced-sized memory cardMICRON TECHNOLOGY INC·Filed 2002·Granted Mar 8, 2005·41 cites·75 claims
- 2289US6396291B1Method for testing semiconductor componentsMICRON TECHNOLOGY INC·Filed 2000·Granted May 28, 2002·40 cites·20 claims
- 2389US6224936B1Method for reducing warpage during application and curing of encapsulant materials on a printed circuit boardMICRON TECHNOLOGY INC·Filed 1998·Granted May 1, 2001·47 cites·12 claims
- 2488US6970359B2Reduced-sized memory card package, length-extending adaptor and method of forming adaptorMICRON TECHNOLOGY INC·Filed 2004·Granted Nov 29, 2005·38 cites·31 claims
- 2588US6703640B1Spring element for use in an apparatus for attaching to a semiconductor and a method of attachingMICRON TECHNOLOGY INC·Filed 2000·Granted Mar 9, 2004·37 cites·29 claims
- 2688US6401580B1Method for sawing wafers employing multiple indexing techniques for multiple die dimensionsMICRON TECHNOLOGY INC·Filed 2000·Granted Jun 11, 2002·20 cites·9 claims
- 2788US6313651B1Carrier and system for testing bumped semiconductor componentsMICRON TECHNOLOGY INC·Filed 1999·Granted Nov 6, 2001·78 cites·24 claims
- 2887US6363295B1Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairsMICRON TECHNOLOGY INC·Filed 1999·Granted Mar 26, 2002·64 cites·35 claims
- 2987US6232243B1Interconnect having recessed contact members with penetrating blades for testing semiconductor dice and packages with contact bumpsMICRON TECHNOLOGY INC·Filed 1999·Granted May 15, 2001·78 cites·20 claims
- 3086US6691696B2Method for sawing wafers employing multiple indexing techniques for multiple die dimensionsMICRON TECHNOLOGY INC·Filed 2001·Granted Feb 17, 2004·17 cites·7 claims
- 3186US6119675AMethod for sawing wafers employing multiple indexing techniques for multiple die dimensionsMICRON TECHNOLOGY INC·Filed 1998·Granted Sep 19, 2000·38 cites·11 claims
- 3285US6006739AMethod for sawing wafers employing multiple indexing techniques for multiple die dimensionsMICRON TECHNOLOGY INC·Filed 1999·Granted Dec 28, 1999·52 cites·20 claims
- 3384US6710612B2CSP BGA test socket with insert and methodMICRON TECHNOLOGY INC·Filed 2002·Granted Mar 23, 2004·20 cites·18 claims
- 3483US7155300B2Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairsMICRON TECHNOLOGY INC·Filed 2003·Granted Dec 26, 2006·25 cites·20 claims
- 3583US6441628B1CSP BGA test socket with insert and methodMICRON TECHNOLOGY INC·Filed 2001·Granted Aug 27, 2002·20 cites·7 claims
- 3681US6250192B1Method for sawing wafers employing multiple indexing techniques for multiple die dimensionsMICRON TECHNOLOGY INC·Filed 1996·Granted Jun 26, 2001·29 cites·7 claims
- 3781US6155247AMethod for sawing wafers employing multiple indexing techniques for multiple die dimensionsMICRON TECHNOLOGY INC·Filed 1999·Granted Dec 5, 2000·27 cites·18 claims
- 3880US7120513B1Method for using data regarding manufacturing procedures integrated circuits (ICS) have undergone, such as repairs, to select procedures the ICS will undergo, such as additional repairsMICRON TECHNOLOGY INC·Filed 2000·Granted Oct 10, 2006·26 cites·102 claims
- 3980US6592670B1Apparatus for reducing warpage during application and curing of encapsulant materials on a printed circuit boardMICRON TECHNOLOGY INC·Filed 2000·Granted Jul 15, 2003·15 cites·22 claims
- 4079US11462580B2Image sensor packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Oct 4, 2022·2 cites·16 claims
- 4179US7561938B2Method for using data regarding manufacturing procedures integrated circuits (ICS) have undergone, such as repairs, to select procedures the ICs will undergo, such as additional repairsMICRON TECHNOLOGY INC·Filed 2006·Granted Jul 14, 2009·7 cites·24 claims
- 4278US6888159B2Substrate mappingMICRON TECHNOLOGY INC·Filed 2002·Granted May 3, 2005·15 cites·32 claims
- 4377US6527999B2Method for reducing warpage during application and curing of encapsulant materials on a printed circuit boardMICRON TECHNOLOGY INC·Filed 2001·Granted Mar 4, 2003·13 cites·12 claims
- 4476US5915755AMethod for forming an interconnect for testing unpackaged semiconductor diceMICRON TECHNOLOGY INC·Filed 1997·Granted Jun 29, 1999·40 cites·20 claims
- 4575US6830719B2Method for reducing warpage during application and curing of encapsulant materials on a printed circuit boardMICRON TECHNOLOGY INC·Filed 2003·Granted Dec 14, 2004·11 cites·11 claims
- 4675US6598290B2Method of making a spring element for use in an apparatus for attaching to a semiconductorMICRON TECHNOLOGY INC·Filed 2002·Granted Jul 29, 2003·11 cites·28 claims
- 4774US6297660B2Test carrier with variable force applying mechanism for testing semiconductor componentsMICRON TECHNOLOGY INC·Filed 2000·Granted Oct 2, 2001·15 cites·18 claims
- 4874US5173451ASoft bond for semiconductor diesMICRON TECHNOLOGY INC·Filed 1992·Granted Dec 22, 1992·55 cites·26 claims
- 4973US6687990B2Sawing method employing multiple indexing techniques and semiconductor device structures fabricated therebyMICRON TECHNOLOGY INC·Filed 2002·Granted Feb 10, 2004·13 cites·19 claims
- 5073US6196096B1Method for sawing wafers employing multiple indexing techniques for multiple die dimensionsMICRON TECHNOLOGY INC·Filed 1999·Granted Mar 6, 2001·18 cites·26 claims
Showing the top 50 of 95 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →