Inventor · disambiguated record
Dennis C.P. Leung
Also filed as: LEUNG DENNIS C P
1 granted patent·1 pending application·24 citations·filing 2008–2013
41Inventor score
Technology areasH10W
Top patents by PatentIndex Score
2 records- 0184US8198724B1Integrated circuit device having a multi-layer substrate and a method of enabling signals to be routed in a multi-layer substrateWU PAUL YING-FUNG·Filed 2008·Granted Jun 12, 2012·24 cites·19 claims
- 0240US2014262440A1Multi-layer core organic package substrateXILINX INC·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →