Inventor · disambiguated record
Defu Liang
Also filed as: LIANG DEFU
1 granted patent·3 pending applications·0 citations·filing 2020–2023
5Inventor score
Technology areasH10P
Files withLAM RES CORP4
Top patents by PatentIndex Score
4 records- 0153US2025308885A1Hydrogen reduction in amorphous carbon filmsLAM RES CORP·Filed 2023·Application pending·0 cites
- 0251US2025112040A1Thin film growth modulation using wafer bowLAM RES CORP·Filed 2023·Application pending·0 cites
- 0345US12293943B2Gold through silicon mask platingLAM RES CORP·Filed 2020·Granted May 6, 2025·0 cites·12 claims
- 0441US2025022696A1Apparatuses and techniques for cleaning a multi-station semiconductor processing chamberLAM RES CORP·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →