Inventor · disambiguated record
Deepak Chandra Pandey
Also filed as: PANDEY DEEPAK · PANDEY DEEPAK C · PANDEY DEEPAK CHANDRA
45 granted patents·13 pending applications·46 citations·filing 2014–2025
96Inventor score
Files withMICRON TECHNOLOGY INC43Nexperia BV7UNIV CENTRAL FLORIDA RES FOUND INC3ABB OY2CAREMATIX INC1
Top patents by PatentIndex Score
58 records- 0195US11769795B2Channel conduction in semiconductor devicesMICRON TECHNOLOGY INC·Filed 2021·Granted Sep 26, 2023·2 cites·19 claims
- 0294US11538809B2Metal insulator semiconductor (MIS) contact in three dimensional (3D) vertical memoryMICRON TECHNOLOGY INC·Filed 2020·Granted Dec 27, 2022·3 cites·27 claims
- 0389US11018255B2Devices and systems with string drivers including high band gap material and methods of formationMICRON TECHNOLOGY INC·Filed 2018·Granted May 25, 2021·4 cites·24 claims
- 0489US10756093B1Methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2019·Granted Aug 25, 2020·6 cites·31 claims
- 0586US11808617B2Measurement circuit for a body weight measuring apparatus for measuring body weight distributionCAREMATIX INC·Filed 2021·Granted Nov 7, 2023·2 cites·8 claims
- 0685US9391206B2Methods of forming transistorsMICRON TECHNOLOGY INC·Filed 2016·Granted Jul 12, 2016·3 cites·16 claims
- 0784US12219758B2Integrated assemblies having transistor body regions coupled to carrier-sink-structures; and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2024·Granted Feb 4, 2025·0 cites·9 claims
- 0882US12166072B2Channel conduction in semiconductor devicesLODESTAR LICENSING GROUP LLC·Filed 2023·Granted Dec 10, 2024·0 cites·20 claims
- 0982US11373913B2Method of forming an array of vertical transistorsMICRON TECHNOLOGY INC·Filed 2019·Granted Jun 28, 2022·2 cites·29 claims
- 1082US9449978B2Semiconductor devices including a recessed access device and methods of forming sameMICRON TECHNOLOGY INC·Filed 2014·Granted Sep 20, 2016·6 cites·23 claims
- 1181US11348932B2Integrated assemblies having transistor body regions coupled to carrier-sink-structures; and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2020·Granted May 31, 2022·1 cites·21 claims
- 1280US10734388B1Integrated assemblies having threshold-voltage-inducing-structures proximate gated-channel-regions, and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2019·Granted Aug 4, 2020·2 cites·25 claims
- 1379US9240477B2Transistor-containing constructions and memory arraysMICRON TECHNOLOGY INC·Filed 2014·Granted Jan 19, 2016·4 cites·35 claims
- 1477US12112995B2Low capacitance through substrate via structuresMICRON TECHNOLOGY INC·Filed 2022·Granted Oct 8, 2024·0 cites·21 claims
- 1577US10269805B2Apparatuses having body connection lines coupled with access devicesMICRON TECHNOLOGY INC·Filed 2018·Granted Apr 23, 2019·3 cites·22 claims
- 1675US9754889B2Electronic component of integrated circuitry and a method of forming a conductive via to a region of semiconductor materialMICRON TECHNOLOGY INC·Filed 2015·Granted Sep 5, 2017·2 cites·12 claims
- 1774US12119269B2Array of vertical transistors having channel regions connected by an elongated conductor lineMICRON TECHNOLOGY INC·Filed 2022·Granted Oct 15, 2024·0 cites·20 claims
- 1874US11362018B2Low capacitance through substrate via structuresMICRON TECHNOLOGY INC·Filed 2019·Granted Jun 14, 2022·1 cites·16 claims
- 1973US2025091452A1Glass fiber-based energy storing composites as high strength structural panelsUNIV CENTRAL FLORIDA RES FOUND INC·Filed 2024·Application pending·0 cites
- 2072US11910597B2Integrated assemblies having transistor body regions coupled to carrier-sink-structures; and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2022·Granted Feb 20, 2024·0 cites·8 claims
- 2172US10622361B2Apparatuses having body connection lines coupled with access devicesMICRON TECHNOLOGY INC·Filed 2019·Granted Apr 14, 2020·2 cites·21 claims
- 2272US2024213318A1Nonlinear Gate Vertical TransistorNexperia BV·Filed 2023·Application pending·0 cites
- 2372US2024213365A1Nonlinear Gate Vertical TransistorNexperia BV·Filed 2023·Application pending·0 cites
- 2469US11527620B2Integrated assemblies having polycrystalline first semiconductor material adjacent conductively-doped second semiconductor materialMICRON TECHNOLOGY INC·Filed 2021·Granted Dec 13, 2022·0 cites·19 claims
- 2563US12094654B2Storing energy in carbon fiber-based electric vehicle body panelsUNIV CENTRAL FLORIDA RES FOUND INC·Filed 2021·Granted Sep 17, 2024·0 cites·20 claims
- 2663US10535378B1Integrated assemblies which include non-conductive-semiconductor-material and conductive-semiconductor-material, and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2018·Granted Jan 14, 2020·1 cites·22 claims
- 2763US2025072029A1Method of Manufacturing MOSFETsNexperia BV·Filed 2024·Application pending·0 cites
- 2863US2021265499A1Devices and systems with string drivers including high band gap material and methods of formationMICRON TECHNOLOGY INC·Filed 2021·Application pending·0 cites
- 2962US11393928B2Access devices formed with conductive contactsMICRON TECHNOLOGY INC·Filed 2020·Granted Jul 19, 2022·0 cites·20 claims
- 3061US11171206B2Channel conduction in semiconductor devicesMICRON TECHNOLOGY INC·Filed 2019·Granted Nov 9, 2021·0 cites·16 claims
- 3161US10825484B2Integrated assemblies which include non-conductive-semiconductor-material and conductive-semiconductor-material, and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2019·Granted Nov 3, 2020·0 cites·27 claims
- 3261US2024429056A1Semiconductor die package and methodNexperia BV·Filed 2024·Application pending·0 cites
- 3361US2025072085A1Power semiconductor device and associated methodsNexperia BV·Filed 2024·Application pending·0 cites
- 3459US11177265B2Integrated assemblies having threshold-voltage-inducing-structures proximate gated-channel-regions, and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2020·Granted Nov 16, 2021·0 cites·13 claims
- 3559US11038027B2Integrated assemblies having polycrystalline first semiconductor material adjacent conductively-doped second semiconductor materialMICRON TECHNOLOGY INC·Filed 2019·Granted Jun 15, 2021·0 cites·37 claims
- 3659US9419556B2Method and arrangement for operating a pumpABB OY·Filed 2014·Granted Aug 16, 2016·2 cites·7 claims
- 3758US10756217B2Access devices formed with conductive contactsMICRON TECHNOLOGY INC·Filed 2018·Granted Aug 25, 2020·0 cites·15 claims
- 3858US2024222496A1Semiconductor DeviceNexperia BV·Filed 2023·Application pending·0 cites
- 3958US2022036927A1Integrated Assemblies Having Void Regions Between Digit Lines and Conductive Structures, and Methods of Forming Integrated AssembliesMICRON TECHNOLOGY INC·Filed 2021·Application pending·0 cites
- 4057US11569353B2Apparatuses including passing word lines comprising a band offset material, and related methods and systemsMICRON TECHNOLOGY INC·Filed 2021·Granted Jan 31, 2023·0 cites·23 claims
- 4157US9147729B2Methods of forming transistorsMICRON TECHNOLOGY INC·Filed 2014·Granted Sep 29, 2015·0 cites·32 claims
- 4256US2025318212A1Semiconductor device and a metal oxide semiconductor field effect transistor implementing such semiconductor deviceNexperia BV·Filed 2025·Application pending·0 cites
- 4355US12354796B2Dual function energy-storing supercapacitor-based carbon fiber composite for body panels of a vehicleUNIV CENTRAL FLORIDA RES FOUND INC·Filed 2022·Granted Jul 8, 2025·0 cites·16 claims
- 4455US10096551B2Electronic component of integrated circuitry and a method of forming a conductive via to a region of semiconductor materialMICRON TECHNOLOGY INC·Filed 2017·Granted Oct 9, 2018·0 cites·15 claims
- 4555US9263341B2Methods of forming transistorsMICRON TECHNOLOGY INC·Filed 2015·Granted Feb 16, 2016·0 cites·17 claims
- 4653US10644005B2Transistors and memory arraysMICRON TECHNOLOGY INC·Filed 2017·Granted May 5, 2020·0 cites·21 claims
- 4753US10490483B2Low capacitance through substrate via structuresMICRON TECHNOLOGY INC·Filed 2016·Granted Nov 26, 2019·0 cites·6 claims
- 4852US11430793B2Microelectronic devices including passing word line structures, and related electronic systems and methodsMICRON TECHNOLOGY INC·Filed 2020·Granted Aug 30, 2022·0 cites·23 claims
- 4952US2023268419A1Devices having a transistor with a modified channel regionLIU HAITAO·Filed 2022·Application pending·0 cites
- 5051US11195560B2Integrated assemblies having void regions between digit lines and conductive structures, and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2019·Granted Dec 7, 2021·0 cites·22 claims
Showing the top 50 of 58 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →