Inventor · disambiguated record
Dexter Reynoso
Also filed as: REYNOSO DEXTER · REYNOSO DEXTER INCIONG
6 granted patents·7 pending applications·16 citations·filing 2000–2025
77Inventor score
Files withINFINEON TECHNOLOGIES AG9INFINEON TECHNOLOGIES AUSTRIA AG2ST ASSEMBLY TEST SERVICE LTD1ST ASSEMBLY TEST SERVICES LTD1
Top patents by PatentIndex Score
13 records- 0184US11355460B1Molded semiconductor package with high voltage isolationINFINEON TECHNOLOGIES AG·Filed 2020·Granted Jun 7, 2022·2 cites·21 claims
- 0277US11699647B2Pre-molded lead frames for semiconductor packagesINFINEON TECHNOLOGIES AG·Filed 2021·Granted Jul 11, 2023·1 cites·20 claims
- 0372US11189592B2Multi-clip structure for die bondingINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2019·Granted Nov 30, 2021·2 cites·12 claims
- 0463US11817407B2Molded semiconductor package with high voltage isolationINFINEON TECHNOLOGIES AG·Filed 2022·Granted Nov 14, 2023·0 cites·21 claims
- 0560US2025038082A1Package with recess for balancing creepage current pathsINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 0658US2025105106A1Semiconductor devices and methods for manufacturing thereofINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 0753US2025014971A1Power Package With Galvanic IsolationINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2023·Application pending·0 cites
- 0850US2024030148A1Semiconductor devices and methods for manufacturing thereofINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 0948US2023307328A1Pre-molded lead frames for semiconductor packagesINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 1045US6525553B1Ground pin concept for singulated ball grid arrayST ASSEMBLY TEST SERVICES LTD·Filed 2000·Granted Feb 25, 2003·6 cites·5 claims
- 1145US2025336775A1Semiconductor packages and associated manufacturing methodsINFINEON TECHNOLOGIES AG·Filed 2025·Application pending·0 cites
- 1240US6597188B1Ground land for singulated ball grid arrayST ASSEMBLY TEST SERVICE LTD·Filed 2000·Granted Jul 22, 2003·5 cites·9 claims
- 1336US2010181675A1Semiconductor package with wedge bonded chipINFINEON TECHNOLOGIES AG·Filed 2009·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →