Inventor · disambiguated record
De Wu
Also filed as: WU DE · WU DE-YUAN
18 granted patents·6 pending applications·305 citations·filing 2000–2024
91Inventor score
Files withWUHAN CHOICE TECH CO LTD10UNITED MICROELECTRONICS CORP6HUBEI CHOICE TECH CO LTD3WUHAN SANXUAN TECH CO LTD1
Top patents by PatentIndex Score
24 records- 0197US6441436B1SOI device and method of fabricationUNITED MICROELECTRONICS CORP·Filed 2000·Granted Aug 27, 2002·187 cites·17 claims
- 0290US12037488B1Liquid molding compound and preparation method thereofHUBEI CHOICE TECH CO LTD·Filed 2024·Granted Jul 16, 2024·1 cites·10 claims
- 0389US6326261B1Method of fabricating a deep trench capacitorUNITED MICROELECTRONICS CORP·Filed 2001·Granted Dec 4, 2001·86 cites·18 claims
- 0478US12024591B2Modification method of polyphenylene ether resin, laminated film composite, laminated film, and substrateWUHAN CHOICE TECH CO LTD·Filed 2023·Granted Jul 2, 2024·0 cites·7 claims
- 0574US12209171B2Liquid epoxy molding compound and preparation method thereofHUBEI CHOICE TECH CO LTD·Filed 2024·Granted Jan 28, 2025·0 cites·5 claims
- 0673US6271088B1Method for fabricating a buried vertical split gate memory device with high coupling ratioUNITED MICROELECTRONICS CORP·Filed 2001·Granted Aug 7, 2001·20 cites·20 claims
- 0768US12252613B1Packaging film and preparation method thereof, and filter chip packaging methodWUHAN CHOICE TECH CO LTD·Filed 2024·Granted Mar 18, 2025·0 cites·12 claims
- 0861US12098230B2Build-up film with low dielectric loss, preparation method therefor and circuit substrate structureWUHAN CHOICE TECH CO LTD·Filed 2023·Granted Sep 24, 2024·0 cites·11 claims
- 0961US11767450B2Adhesive, die attach film and preparation method thereforWUHAN CHOICE TECH CO LTD·Filed 2023·Granted Sep 26, 2023·0 cites·10 claims
- 1060US11978686B2Chip protective film and method for manufacturing same, and chipWUHAN CHOICE TECH CO LTD·Filed 2023·Granted May 7, 2024·0 cites·7 claims
- 1160US11879076B1Composition, adhesive film and chip packaging structureWUHAN CHOICE TECH CO LTD·Filed 2023·Granted Jan 23, 2024·0 cites·11 claims
- 1260US11804463B2Underfill for chip packaging and chip packaging structureWUHAN CHOICE TECH CO LTD·Filed 2023·Granted Oct 31, 2023·0 cites·8 claims
- 1359US12255175B1Wafer warpage regulation epoxy functional film, and preparation method and application thereofWUHAN SANXUAN TECH CO LTD·Filed 2024·Granted Mar 18, 2025·0 cites·4 claims
- 1456US6432827B1ILD planarization methodUNITED MICROELECTRONICS CORP·Filed 2000·Granted Aug 13, 2002·8 cites·6 claims
- 1551US2024030075A1Die sealant for chip packaging and packaging structureWUHAN CHOICE TECH CO LTD·Filed 2023·Application pending·0 cites
- 1649US2023295415A1High-glossiness epoxy molding compound (emc) film for protecting chip and preparation method thereofWUHAN CHOICE TECH CO LTD·Filed 2023·Application pending·0 cites
- 1747US11286386B1Circuit build-up film for wafer-level packaging, and fabrication method and use thereofWUHAN CHOICE TECH CO LTD·Filed 2021·Granted Mar 29, 2022·0 cites·20 claims
- 1844US6368964B1Method for reducing resistance in a conductorUNITED MICROELECTRONICS CORP·Filed 2000·Granted Apr 9, 2002·1 cites·12 claims
- 1943US11643499B2Liquid molding compound for protecting five edges of semiconductor chip and preparation method thereofHUBEI CHOICE TECH CO LTD·Filed 2020·Granted May 9, 2023·0 cites·5 claims
- 2038US6466474B1Memory module having a two-transistor memory cellUNITED MICROELECTRONICS CORP·Filed 2001·Granted Oct 15, 2002·2 cites·4 claims
- 2132US2002110983A1Method of fabricating a split-gate flash memory cellFiled 2001·Application pending·0 cites
- 2232US2002072155A1Method of fabricating a DRAM unitFiled 2000·Application pending·0 cites
- 2332US2002063285A1SOI device and method of fabricationFiled 2000·Application pending·0 cites
- 2427US2002111005A1Method of forming a contact padFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →