Inventor · disambiguated record
Dimitrios Antartis
Also filed as: ANTARTIS DIMITRIOS
1 granted patent·4 pending applications·0 citations·filing 2021–2023
7Inventor score
Technology areasH10W
Files withINTEL CORP5
Top patents by PatentIndex Score
5 records- 0154US2025105207A1Integrated circuit packages with double hybrid bonded dies and methods of manufacturing the sameINTEL CORP·Filed 2023·Application pending·0 cites
- 0252US2025006678A1Packaging architecture for wafer-scale known-good-die hybrid bondingINTEL CORP·Filed 2023·Application pending·0 cites
- 0351US12431441B2Interlayer dielectric stack optimization for wafer bow reductionINTEL CORP·Filed 2021·Granted Sep 30, 2025·0 cites·17 claims
- 0447US2024006332A1Fiducial marks for verifying alignment accuracy of bonded integrated circuit diesINTEL CORP·Filed 2022·Application pending·0 cites
- 0540US2023108000A1Topological crack stop (tcs) passivation layerINTEL CORP·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →