Inventor · disambiguated record
Dinesh Gupta
Also filed as: GUPTA DINESH · GUPTA DINESH C
26 granted patents·2 pending applications·368 citations·filing 1993–2020
96Inventor score
Top patents by PatentIndex Score
28 records- 0199US10553522B1Semiconductor microcoolerIBM·Filed 2018·Granted Feb 4, 2020·20 cites·6 claims
- 0294US10553516B1Semiconductor microcoolerIBM·Filed 2018·Granted Feb 4, 2020·10 cites·6 claims
- 0390US5480503AProcess for producing circuitized layers and multilayer ceramic sub-laminates and composites thereofIBM·Filed 1993·Granted Jan 2, 1996·127 cites·11 claims
- 0489US10943883B1Planar wafer level fan-out of multi-chip modules having different size chipsIBM·Filed 2019·Granted Mar 9, 2021·6 cites·20 claims
- 0587US10580738B2Direct bonded heterogeneous integration packaging structuresIBM·Filed 2018·Granted Mar 3, 2020·4 cites·15 claims
- 0687US10490480B1Copper microcooler structure and fabricationIBM·Filed 2018·Granted Nov 26, 2019·4 cites·25 claims
- 0785US10490481B1Copper microcooler structure and fabricationIBM·Filed 2018·Granted Nov 26, 2019·3 cites·20 claims
- 0881US11049844B2Semiconductor wafer having trenches with varied dimensions for multi-chip modulesIBM·Filed 2019·Granted Jun 29, 2021·3 cites·4 claims
- 0981US5629216AMethod for producing semiconductor wafers with low light scattering anomaliesSEH AMERICA INC·Filed 1996·Granted May 13, 1997·54 cites·12 claims
- 1071US10937764B2Three-dimensional microelectronic package with embedded cooling channelsIBM·Filed 2019·Granted Mar 2, 2021·1 cites·17 claims
- 1169US6713686B2Apparatus and method for repairing electronic packagesIBM·Filed 2002·Granted Mar 30, 2004·16 cites·20 claims
- 1269US5601672AMethod for making ceramic substrates from thin and thick ceramic greensheetsIBM·Filed 1994·Granted Feb 11, 1997·42 cites·10 claims
- 1366US11462512B2Three-dimensional microelectronic package with embedded cooling channelsIBM·Filed 2020·Granted Oct 4, 2022·0 cites·20 claims
- 1462US6631675B2Screening method for double pass screeningIBM·Filed 2001·Granted Oct 14, 2003·5 cites·8 claims
- 1560US11177217B2Direct bonded heterogeneous integration packaging structuresIBM·Filed 2020·Granted Nov 16, 2021·0 cites·7 claims
- 1659US11056418B2Semiconductor microcoolerIBM·Filed 2019·Granted Jul 6, 2021·0 cites·20 claims
- 1758US11049789B2Semiconductor microcoolerIBM·Filed 2019·Granted Jun 29, 2021·0 cites·20 claims
- 1858US6341417B1Pre-patterned substrate layers for being personalized as neededIBM·Filed 1999·Granted Jan 29, 2002·19 cites·15 claims
- 1951US6662718B2Screening mask having a stress-relieving areaIBM·Filed 2001·Granted Dec 16, 2003·2 cites·16 claims
- 2047US6836015B2Optical assemblies for transmitting and manipulating optical beamsIBM·Filed 2003·Granted Dec 28, 2004·1 cites·20 claims
- 2146US8089133B2Optical assemblies for transmitting and manipulating optical beamsGUPTA DINESH·Filed 2004·Granted Jan 3, 2012·1 cites·12 claims
- 2244US5655209AMultilayer ceramic substrates having internal capacitor, and process for producing sameIBM·Filed 1995·Granted Aug 5, 1997·12 cites·11 claims
- 2343US6005228AElectrical heating systemsFiled 1997·Granted Dec 21, 1999·16 cites·10 claims
- 2439US6231707B1Method of forming a multilayer ceramic substrate with max-punched viasIBM·Filed 1998·Granted May 15, 2001·8 cites·5 claims
- 2538US6475555B2Process for screening features on an electronic substrate with a low viscosity pasteIBM·Filed 1999·Granted Nov 5, 2002·7 cites·6 claims
- 2638US6245185B1Method of making a multilayer ceramic product with thin layersIBM·Filed 1999·Granted Jun 12, 2001·7 cites·27 claims
- 2738US2002023779A1Pre-patterned substrate layers for being personalized as neededFiled 2001·Application pending·0 cites
- 2833US2015265805A1Catheter with GillsVAKILI AHMAD D·Filed 2015·Application pending·0 cites
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