Inventor · disambiguated record
Diann-Fang Lin
Also filed as: LIN DIANN-FANG
15 granted patents·22 pending applications·40 citations·filing 2004–2022
89Inventor score
Files withADVANCED CHIP ENG TECH INC18DAWNING LEADING TECH INC5LIN DIANN FANG4ASMEDITRON INC3DAWNING LEADING TECHNOLOGY INC2
Top patents by PatentIndex Score
37 records- 0185US7525185B2Semiconductor device package having multi-chips with side-by-side configuration and method of the sameADVANCED CHIP ENG TECH INC·Filed 2007·Granted Apr 28, 2009·14 cites·16 claims
- 0279US9412722B1Multichip stacking package structure and method for manufacturing the sameDAWNING LEADING TECH INC·Filed 2015·Granted Aug 9, 2016·4 cites·9 claims
- 0374US7763494B2Semiconductor device package with multi-chips and method of the sameADVANCED CHIP ENG TECH INC·Filed 2008·Granted Jul 27, 2010·5 cites·21 claims
- 0472US8058102B2Package structure and manufacturing method thereofLIN DIANN-FANG·Filed 2009·Granted Nov 15, 2011·5 cites·7 claims
- 0569US11927430B2Dartboard structure and method for manufacturing the sameASMEDITRON INC·Filed 2021·Granted Mar 12, 2024·1 cites·5 claims
- 0668US7498556B2Image sensor module having build-in package cavity and the method of the sameADAVANCED CHIP ENGINEERING TEC·Filed 2007·Granted Mar 3, 2009·6 cites·15 claims
- 0765US9892988B2Semiconductor packaging structure and manufacturing method for the sameDAWNING LEADING TECH INC·Filed 2014·Granted Feb 13, 2018·2 cites·15 claims
- 0858US10651146B2Chip packaging structure and manufacturing method for the sameLIN DIANN FANG·Filed 2012·Granted May 12, 2020·1 cites·7 claims
- 0948US7369957B2Method and system for generating test pulses to test electronic elementsKING YUAN ELECTRONICS CO LTD·Filed 2007·Granted May 6, 2008·2 cites·11 claims
- 1048US2008197474A1Semiconductor device package with multi-chips and method of the sameADVANCED CHIP ENG TECH INC·Filed 2007·Application pending·0 cites
- 1147US8749048B2Package structureLIN DIANN-FANG·Filed 2011·Granted Jun 10, 2014·0 cites·13 claims
- 1246US2011031607A1Conductor package structure and method of the sameADVANCED CHIP ENG TECH INC·Filed 2009·Application pending·0 cites
- 1345US9646937B2Packaging structure for thin die and method for manufacturing the sameDAWNING LEADING TECH INC·Filed 2014·Granted May 9, 2017·0 cites·6 claims
- 1445US9161446B2Micro electronic component structureDAWNING LEADING TECHNOLOGY INC·Filed 2014·Granted Oct 13, 2015·0 cites·16 claims
- 1545US2008191335A1Cmos image sensor chip scale package with die receiving opening and method of the sameADVANCED CHIP ENG TECH INC·Filed 2007·Application pending·0 cites
- 1644US2008211075A1Image sensor chip scale package having inter-adhesion with gap and method of the sameADVANCED CHIP ENG TECH INC·Filed 2007·Application pending·0 cites
- 1744US2009008777A1Inter-connecting structure for semiconductor device package and method of the sameADVANCED CHIP ENG TECH INC·Filed 2007·Application pending·0 cites
- 1844US2008197480A1Semiconductor device package with multi-chips and method of the sameADVANCED CHIP ENG TECH INC·Filed 2007·Application pending·0 cites
- 1943US9607933B2Lead frame structure for quad flat no-lead package, quad flat no-lead package and method for forming the lead frame structureDAWNING LEADING TECH INC·Filed 2014·Granted Mar 28, 2017·0 cites·5 claims
- 2043US2008251908A1Semiconductor device package having multi-chips with side-by-side configuration and method of the sameADVANCED CHIP ENG TECH INC·Filed 2007·Application pending·0 cites
- 2143US2008258293A1Semiconductor device package to improve functions of heat sink and ground shieldADVANCED CHIP ENG TECH INC·Filed 2007·Application pending·0 cites
- 2243US2008224276A1Semiconductor device packageADVANCED CHIP ENG TECH INC·Filed 2007·Application pending·0 cites
- 2343US2008083980A1Cmos image sensor chip scale package with die receiving through-hole and method of the sameADVANCED CHIP ENG TECH INC·Filed 2007·Application pending·0 cites
- 2443US2008265393A1Stack package with releasing layer and method for forming the sameADVANCED CHIP ENG TECH INC·Filed 2007·Application pending·0 cites
- 2543US2008211080A1Package structure to improve the reliability for WLPADVANCED CHIP ENG TECH INC·Filed 2007·Application pending·0 cites
- 2642US2008191333A1Image sensor package with die receiving opening and method of the sameADVANCED CHIP ENG TECH INC·Filed 2007·Application pending·0 cites
- 2742US2008197478A1Semiconductor device package with die receiving through-hole and connecting through-hole and method of the sameYANG WEN-KUN·Filed 2007·Application pending·0 cites
- 2841US2022404127A1Electronic darting system, processing method for an electronic darts game, and dartboard deviceASMEDITRON INC·Filed 2022·Application pending·0 cites
- 2939US8962390B2Method for manufacturing a chip packaging structureLIN DIANN-FANG·Filed 2011·Granted Feb 24, 2015·0 cites·7 claims
- 3037US2011209908A1Conductor package structure and method of the sameADVANCED CHIP ENG TECH INC·Filed 2010·Application pending·0 cites
- 3136US2011180891A1Conductor package structure and method of the sameADVANCED CHIP ENG TECH INC·Filed 2010·Application pending·0 cites
- 3236US2011031594A1Conductor package structure and method of the sameADVANCED CHIP ENG TECH INC·Filed 2010·Application pending·0 cites
- 3335US9887145B2Metal top stacking package structure and method for manufacturing the sameDAWNING LEADING TECH INC·Filed 2015·Granted Feb 6, 2018·0 cites·13 claims
- 3433US2013120947A1Electrical device with connection interface, circuit board thereof, and method for manufacturing the sameDAWNING LEADING TECHNOLOGY INC·Filed 2012·Application pending·0 cites
- 3532US2006260648A1Apparatus and method of automatically cleaning a pick-up headKING YUAN ELECTRONICS CO LTD·Filed 2005·Application pending·0 cites
- 3631US2022325989A1Magnetic induction dart and magnetic induction darting systemASMEDITRON INC·Filed 2022·Application pending·0 cites
- 3727US2005209805A1Method and system for generating test pulses to test electronic elementsCHANG SHIH-BOU·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →