Inventor · disambiguated record
Din-Ghee Neoh
Also filed as: NEOH DIN-GHEE
4 granted patents·4 pending applications·3 citations·filing 2007–2021
61Inventor score
Files withATOTECH DEUTSCHLAND GMBH5ST MICROELECTRONICS INT NV1ST MICROELECTRONICS SRL1WUNDERLICH CHRISTIAN1
Top patents by PatentIndex Score
8 records- 0180US11011476B2Lead frame surface finishingST MICROELECTRONICS INT NV·Filed 2019·Granted May 18, 2021·3 cites·19 claims
- 0264US11756899B2Lead frame surface finishingST MICROELECTRONICS SRL·Filed 2021·Granted Sep 12, 2023·0 cites·20 claims
- 0357US2016222523A1Solution and process to treat surfaces of copper alloys in order to improve the adhesion between the metal surface and the bonded polymeric materialATOTECH DEUTSCHLAND GMBH·Filed 2016·Application pending·0 cites
- 0457US2016168722A1Solution and process to treat surfaces of copper alloys in order to improve the adhesion between the metal surface and the bonded polymeric materialATOTECH DEUTSCHLAND GMBH·Filed 2016·Application pending·0 cites
- 0547US10867895B2Lead-frame structure, lead-frame, surface mount electronic device and methods of producing sameATOTECH DEUTSCHLAND GMBH·Filed 2018·Granted Dec 15, 2020·0 cites·14 claims
- 0646US2010288731A1Solution and Process to Treat Surfaces of Copper Alloys in Order to Improve the Adhesion Between the Metal Surface and the Bonded Polymeric MaterialWUNDERLICH CHRISTIAN·Filed 2007·Application pending·0 cites
- 0743US10832997B2Lead-frame structure, lead-frame, surface mount electronic device and methods of producing sameATOTECH DEUTSCHLAND GMBH·Filed 2017·Granted Nov 10, 2020·0 cites·10 claims
- 0831US2019271093A1A method of depositing a tin layer on a metal substrate and a use of a structure comprising a nickel/phosphorous alloy underlayer and said tin layer with said methodATOTECH DEUTSCHLAND GMBH·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →