Inventor · disambiguated record

Dimantha Rajapaksa

Also filed as: RAJAPAKSA DIMANTHA

3 granted patents·1 pending application·7 citations·filing 2017–2023

59Inventor score

Technology areasH10P

Files withAPPLIED MATERIALS INC4

Top patents by PatentIndex Score

4 records

0182US10446423B2Next generation warpage measurement systemAPPLIED MATERIALS INC·Filed 2017·Granted Oct 15, 2019·4 cites·20 claims
0279US10325790B2Methods and apparatus for correcting substrate deformityAPPLIED MATERIALS INC·Filed 2017·Granted Jun 18, 2019·3 cites·20 claims
0363US2023187215A1Electrostatic chuck with reduced current leakage for hybrid laser scribing and plasma etch wafer singulation processAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
0456US11600492B2Electrostatic chuck with reduced current leakage for hybrid laser scribing and plasma etch wafer singulation processAPPLIED MATERIALS INC·Filed 2019·Granted Mar 7, 2023·0 cites·20 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →