Inventor · disambiguated record
Digvijay A. Raorane
Also filed as: RAORANE DIGVIJAY · RAORANE DIGVIJAY A · RAORANE DIGVIJAY ASHOKKUMAR
45 granted patents·20 pending applications·250 citations·filing 2009–2025
97Inventor score
Top patents by PatentIndex Score
65 records- 0198US11581235B2IC package including multi-chip unit with bonded integrated heat spreaderINTEL CORP·Filed 2021·Granted Feb 14, 2023·4 cites·20 claims
- 0298US10199354B2Die sidewall interconnects for 3D chip assembliesINTEL CORP·Filed 2016·Granted Feb 5, 2019·153 cites·17 claims
- 0397US11749577B2IC package including multi-chip unit with bonded integrated heat spreaderINTEL CORP·Filed 2022·Granted Sep 5, 2023·2 cites·20 claims
- 0497US11742261B2Nested architectures for enhanced heterogeneous integrationINTEL CORP·Filed 2022·Granted Aug 29, 2023·2 cites·20 claims
- 0596US11011448B2IC package including multi-chip unit with bonded integrated heat spreaderINTEL CORP·Filed 2019·Granted May 18, 2021·9 cites·18 claims
- 0695US11978948B2Die with embedded communication cavityINTEL CORP·Filed 2021·Granted May 7, 2024·2 cites·19 claims
- 0792US10373893B2Embedded bridge with through-silicon viasINTEL CORP·Filed 2017·Granted Aug 6, 2019·9 cites·16 claims
- 0891US9000599B2Multichip integration with through silicon via (TSV) die embedded in packageRAORANE DIGVIJAY A·Filed 2013·Granted Apr 7, 2015·14 cites·13 claims
- 0990US2025323114A1Ic package including multi-chip unit with bonded integrated heat spreaderINTEL CORP·Filed 2025·Application pending·0 cites
- 1089US2025087548A1Ic package including multi-chip unit with bonded integrated heat spreaderINTEL CORP·Filed 2024·Application pending·0 cites
- 1188US11049798B2Embedded bridge with through-silicon ViasINTEL CORP·Filed 2019·Granted Jun 29, 2021·4 cites·20 claims
- 1286US11322457B2Control of warpage using ABF GC cavity for embedded die packageINTEL CORP·Filed 2020·Granted May 3, 2022·2 cites·17 claims
- 1385US12243806B2Nested architectures for enhanced heterogeneous integrationINTEL CORP·Filed 2023·Granted Mar 4, 2025·0 cites·20 claims
- 1485US2025046680A1Embedded bridge with through-silicon viasINTEL CORP·Filed 2024·Application pending·0 cites
- 1584US12142545B2Nested architectures for enhanced heterogeneous integrationINTEL CORP·Filed 2023·Granted Nov 12, 2024·0 cites·20 claims
- 1683US12183649B2IC package including multi-chip unit with bonded integrated heat spreaderINTEL CORP·Filed 2023·Granted Dec 31, 2024·0 cites·20 claims
- 1783US9716084B2Multichip integration with through silicon via (TSV) die embedded in packageINTEL CORP·Filed 2016·Granted Jul 25, 2017·3 cites·10 claims
- 1883US2025372578A1Semiconductor package having passive support waferINTEL CORP·Filed 2025·Application pending·0 cites
- 1982US11128029B2Die with embedded communication cavityINTEL CORP·Filed 2016·Granted Sep 21, 2021·3 cites·16 claims
- 2082US8158522B2Method of forming a deep trench in a substrateSIRAJUDDIN KHALID M·Filed 2010·Granted Apr 17, 2012·10 cites·16 claims
- 2180US11488880B2Enclosure for an electronic componentINTEL CORP·Filed 2017·Granted Nov 1, 2022·3 cites·23 claims
- 2280US10403578B2Electronic device packageINTEL CORP·Filed 2017·Granted Sep 3, 2019·3 cites·24 claims
- 2379US12159813B2Embedded bridge die with through-silicon viasINTEL CORP·Filed 2023·Granted Dec 3, 2024·0 cites·18 claims
- 2479US12027448B2Open cavity bridge power delivery architectures and processesINTEL CORP·Filed 2020·Granted Jul 2, 2024·1 cites·11 claims
- 2579US10373888B2Electronic package assembly with compact die placementINTEL CORP·Filed 2016·Granted Aug 6, 2019·3 cites·13 claims
- 2679US9520350B2Bumpless build-up layer (BBUL) semiconductor package with ultra-thin dielectric layerTEH WENG HONG·Filed 2013·Granted Dec 13, 2016·5 cites·15 claims
- 2779US2025174523A1Nested architectures for enhanced heterogeneous integrationINTEL CORP·Filed 2025·Application pending·0 cites
- 2877US12068222B2Dummy die structures of a packaged integrated circuit deviceINTEL CORP·Filed 2020·Granted Aug 20, 2024·1 cites·15 claims
- 2976US11798865B2Nested architectures for enhanced heterogeneous integrationINTEL CORP·Filed 2019·Granted Oct 24, 2023·1 cites·21 claims
- 3075US11195806B2High frequency waveguide structureINTEL CORP·Filed 2016·Granted Dec 7, 2021·2 cites·20 claims
- 3175US10375832B2Method of forming an interference shield on a substrateINTEL CORP·Filed 2015·Granted Aug 6, 2019·2 cites·12 claims
- 3273US12009318B2Control of warpage using ABF GC cavity for embedded die packageINTEL CORP·Filed 2022·Granted Jun 11, 2024·0 cites·23 claims
- 3373US11587851B2Embedded bridge with through-silicon viasINTEL CORP·Filed 2021·Granted Feb 21, 2023·0 cites·22 claims
- 3472US10707169B1Ceramic interposers for on-die interconnectsINTEL CORP·Filed 2018·Granted Jul 7, 2020·1 cites·14 claims
- 3572US9721906B2Electronic package with corner supportsINTEL CORP·Filed 2015·Granted Aug 1, 2017·2 cites·12 claims
- 3670US11569173B2Bridge hub tiling architectureINTEL CORP·Filed 2017·Granted Jan 31, 2023·1 cites·21 claims
- 3770US11417630B2Semiconductor package having passive support waferINTEL CORP·Filed 2016·Granted Aug 16, 2022·1 cites·15 claims
- 3870US10421432B2Tamper resistant lock assembly having physical unclonable functionsINTEL CORP·Filed 2017·Granted Sep 24, 2019·2 cites·25 claims
- 3970US9232686B2Thin film based electromagnetic interference shielding with BBUL/coreless packagesINTEL CORP·Filed 2014·Granted Jan 5, 2016·2 cites·12 claims
- 4070US2022352121A1Semiconductor package having passive support waferINTEL CORP·Filed 2022·Application pending·0 cites
- 4168US2023138386A1Bridge hub tiling architectureINTEL CORP·Filed 2022·Application pending·0 cites
- 4265US11594493B2Ceramic interposers for on-die interconnectsINTEL CORP·Filed 2020·Granted Feb 28, 2023·0 cites·18 claims
- 4365US9397079B2Multichip integration with through silicon via (TSV) die embedded in packageINTEL CORP·Filed 2015·Granted Jul 19, 2016·1 cites·10 claims
- 4461US2021375719A1Stacked die architectures with improved thermal managementINTEL CORP·Filed 2021·Application pending·0 cites
- 4559US8957013B2Receptors useful for gas phase chemical sensingJAWORSKI JUSTYN W·Filed 2009·Granted Feb 17, 2015·2 cites·5 claims
- 4659US2024278533A1Adhesive Structures for Electronic DevicesAPPLE INC·Filed 2024·Application pending·0 cites
- 4752US12176268B2Open cavity bridge co-planar placement architectures and processesINTEL CORP·Filed 2020·Granted Dec 24, 2024·0 cites·6 claims
- 4849US10804117B2Method to enable interposer to interposer connectionINTEL CORP·Filed 2018·Granted Oct 13, 2020·0 cites·23 claims
- 4948US11742270B2Landing pad apparatus for through-silicon-viasINTEL CORP·Filed 2016·Granted Aug 29, 2023·0 cites·20 claims
- 5048US2020083180A1Electronic package assembly with stiffenerINTEL CORP·Filed 2016·Application pending·0 cites
Showing the top 50 of 65 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →