Inventor · disambiguated record
Dmitry Klochkov
Also filed as: KLOCHKOV DMITRY
7 granted patents·19 pending applications·0 citations·filing 2020–2025
68Inventor score
Files withZEISS CARL SMT GMBH26
Top patents by PatentIndex Score
26 records- 0178US2025357165A1Methods of cross-section imaging of an inspection volume in a waferZEISS CARL SMT GMBH·Filed 2025·Application pending·0 cites
- 0278US2024328970A1Method of 3d volume inspection of semiconductor wafers with increased throughputZEISS CARL SMT GMBH·Filed 2024·Application pending·0 cites
- 0368US2025239474A1Contact area size determination between 3d structures in an integrated semiconductor sampleZEISS CARL SMT GMBH·Filed 2025·Application pending·0 cites
- 0467US12283504B2Contact area size determination between 3D structures in an integrated semiconductor sampleZEISS CARL SMT GMBH·Filed 2022·Granted Apr 22, 2025·0 cites·20 claims
- 0565US11915908B2Method for measuring a sample and microscope implementing the methodZEISS CARL SMT GMBH·Filed 2021·Granted Feb 27, 2024·0 cites·21 claims
- 0663US2023196189A1Measurement method and apparatus for semiconductor features with increased throughputZEISS CARL SMT GMBH·Filed 2022·Application pending·0 cites
- 0762US2025362253A13d volume inspection method and method of configuring of a 3d volume inspection methodZEISS CARL SMT GMBH·Filed 2025·Application pending·0 cites
- 0861US12148139B2Methods and evaluation devices for analyzing three-dimensional data sets representing devicesZEISS CARL SMT GMBH·Filed 2021·Granted Nov 19, 2024·0 cites·20 claims
- 0961US2025022680A13d volume inspection of semiconductor wafers with increased throughput and accuracyZEISS CARL SMT GMBH·Filed 2024·Application pending·0 cites
- 1060US11848172B2Method for measuring a sample and microscope implementing the methodZEISS CARL SMT GMBH·Filed 2021·Granted Dec 19, 2023·0 cites·25 claims
- 1160US2025272946A1Sensor fusion for thin film segmentationZEISS CARL SMT GMBH·Filed 2025·Application pending·0 cites
- 1260US2025069958A1Dual beam systems and methods for decoupling the working distance of a charged particle beam device from focused ion beam geometry induced constraintsZEISS CARL SMT GMBH·Filed 2024·Application pending·0 cites
- 1359US12288706B2Parameterizing x-ray scattering measurement using slice-and-image tomographic imaging of semiconductor structuresZEISS CARL SMT GMBH·Filed 2022·Granted Apr 29, 2025·0 cites·16 claims
- 1459US2025104963A1Beam angle rotation and sample rotationZEISS CARL SMT GMBH·Filed 2024·Application pending·0 cites
- 1558US12056865B2Wafer-tilt determination for slice-and-image processZEISS CARL SMT GMBH·Filed 2021·Granted Aug 6, 2024·0 cites·25 claims
- 1658US2024331179A13d volume inspection of semiconductor wafers with increased accuracyZEISS CARL SMT GMBH·Filed 2024·Application pending·0 cites
- 1757US2025166962A1Method for distortion measurement and parameter setting for charged particle beam imaging devices and corresponding devicesZEISS CARL SMT GMBH·Filed 2025·Application pending·0 cites
- 1857US2024311698A1Measurement method and apparatus for semiconductor features with increased throughputZEISS CARL SMT GMBH·Filed 2024·Application pending·0 cites
- 1957US2025259413A1Method and apparatus for segmentation of semiconductor inspection imagesZEISS CARL SMT GMBH·Filed 2025·Application pending·0 cites
- 2054US2024087134A1Segmentation or cross sections of high aspect ratio structuresZEISS CARL SMT GMBH·Filed 2023·Application pending·0 cites
- 2153US2023267627A1Transferring alignment information in 3d tomography from a first set of images to a second set of imagesZEISS CARL SMT GMBH·Filed 2023·Application pending·0 cites
- 2251US12288705B2FIB-SEM 3D tomography for measuring shape deviations of HAR structuresZEISS CARL SMT GMBH·Filed 2022·Granted Apr 29, 2025·0 cites·19 claims
- 2351US2024281952A13d volume inspection method and method of configuring of a 3d volume inspection methodZEISS CARL SMT GMBH·Filed 2023·Application pending·0 cites
- 2447US2022383485A1Method and apparatus for analyzing an image of a microlithographic microstructured componentZEISS CARL SMT GMBH·Filed 2022·Application pending·0 cites
- 2546US2022138973A1Cross section imaging with improved 3d volume image reconstruction accuracyZEISS CARL SMT GMBH·Filed 2021·Application pending·0 cites
- 2645US2020218160A1Method for characterising at least one optical component of a projection exposure apparatusZEISS CARL SMT GMBH·Filed 2020·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Dmitry Klochkov files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →