Inventor · disambiguated record
Dnyanesh Chandrakant Tamboli
Also filed as: TAMBOLI DNYANESH · TAMBOLI DNYANESH C · TAMBOLI DNYANESH CHANDRAKANT
17 granted patents·9 pending applications·34 citations·filing 2002–2020
90Inventor score
Files withVERSUM MAT US LLC10AIR PROD & CHEM6TAMBOLI DNYANESH CHANDRAKANT4AGERE SYSTEMS INC1CHANG SONG Y1
Top patents by PatentIndex Score
26 records- 0191US8765653B2Formulations and method for post-CMP cleaningTAMBOLI DNYANESH CHANDRAKANT·Filed 2010·Granted Jul 1, 2014·12 cites·27 claims
- 0287US10032644B2Barrier chemical mechanical planarization slurries using ceria-coated silica abrasivesAIR PROD & CHEM·Filed 2016·Granted Jul 24, 2018·5 cites·18 claims
- 0384US10253216B2Additives for barrier chemical mechanical planarizationVERSUM MAT US LLC·Filed 2017·Granted Apr 9, 2019·4 cites·34 claims
- 0479US11560533B2Post chemical mechanical planarization (CMP) cleaningVERSUM MAT US LLC·Filed 2019·Granted Jan 24, 2023·3 cites·6 claims
- 0570US10418247B2Composite abrasive particles for chemical mechanical planarization composition and method of use thereofAIR PROD & CHEM·Filed 2016·Granted Sep 17, 2019·1 cites·12 claims
- 0669US10109493B2Composite abrasive particles for chemical mechanical planarization composition and method of use thereofAIR PROD & CHEM·Filed 2016·Granted Oct 23, 2018·1 cites·21 claims
- 0767US10669449B2Composite abrasive particles for chemical mechanical planarization composition and method of use thereofVERSUM MAT US LLC·Filed 2018·Granted Jun 2, 2020·0 cites·21 claims
- 0860US8883701B2Method for wafer dicing and composition useful thereofTAMBOLI DNYANESH CHANDRAKANT·Filed 2011·Granted Nov 11, 2014·1 cites·10 claims
- 0960US6972083B2Electrochemical method and system for monitoring hydrogen peroxide concentration in slurriesAGERE SYSTEMS INC·Filed 2002·Granted Dec 6, 2005·7 cites·6 claims
- 1057US11111415B2Chemical mechanical planarization of films comprising elemental siliconVERSUM MAT US LLC·Filed 2019·Granted Sep 7, 2021·0 cites·13 claims
- 1156US10894906B2Composite particles, method of refining and use thereofVERSUM MAT US LLC·Filed 2019·Granted Jan 19, 2021·0 cites·9 claims
- 1255US2009291873A1Method and Composition for Post-CMP Cleaning of Copper Interconnects Comprising Noble Metal Barrier LayersAIR PROD & CHEM·Filed 2009·Application pending·0 cites
- 1351US9328318B2Method for wafer dicing and composition useful thereofTAMBOLI DNYANESH CHANDRAKANT·Filed 2014·Granted May 3, 2016·0 cites·11 claims
- 1451US2018244955A1Chemical Mechanical Planarization of Films Comprising Elemental SiliconVERSUM MAT US LLC·Filed 2018·Application pending·0 cites
- 1550US10421890B2Composite particles, method of refining and use thereofVERSUM MAT US LLC·Filed 2017·Granted Sep 24, 2019·0 cites·11 claims
- 1650US10373842B2Composition and method used for chemical mechanical planarization of metalsVERSUM MAT US LLC·Filed 2015·Granted Aug 6, 2019·0 cites·20 claims
- 1747US2022372332A1With-In Die Non-Uniformities (WID-NU) In PlanarizationVERSUM MAT US LLC·Filed 2020·Application pending·0 cites
- 1846US11643599B2Tungsten chemical mechanical polishing for reduced oxide erosionVERSUM MAT US LLC·Filed 2019·Granted May 9, 2023·0 cites·16 claims
- 1946US7977121B2Method and composition for restoring dielectric properties of porous dielectric materialsAIR PROD & CHEM·Filed 2006·Granted Jul 12, 2011·0 cites·15 claims
- 2046US2008254629A1Composition and method used for chemical mechanical planarization of metalsCHANG SONG Y·Filed 2008·Application pending·0 cites
- 2137US2012295447A1Compositions and Methods for Texturing of Silicon WafersTAMBOLI DNYANESH CHANDRAKANT·Filed 2011·Application pending·0 cites
- 2237US2013130508A1Compositions and Methods for Texturing of Silicon WafersWU AIPING·Filed 2012·Application pending·0 cites
- 2335US2004175942A1Composition and method used for chemical mechanical planarization of metalsFiled 2003·Application pending·0 cites
- 2435US2005205835A1Alkaline post-chemical mechanical planarization cleaning compositionsTAMBOLI DNYANESH C·Filed 2005·Application pending·0 cites
- 2534US8580656B2Process for inhibiting corrosion and removing contaminant from a surface during wafer dicing and composition useful thereforCOLLIER TERENCE QUINTIN·Filed 2009·Granted Nov 12, 2013·0 cites·9 claims
- 2633US2016122590A1Chemical Mechanical Polishing Slurry for Reducing Corrosion and Method of Use ThereforAIR PROD & CHEM·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →