Inventor · disambiguated record
Dongshun Bai
Also filed as: BAI DONGSHUN
8 granted patents·38 citations·filing 2008–2018
84Inventor score
Top patents by PatentIndex Score
8 records- 0192US8092628B2Cyclic olefin compositions for temporary wafer bondingHONG WENBIN·Filed 2008·Granted Jan 10, 2012·17 cites·13 claims
- 0287US9827740B2Polyimides as laser release materials for 3-D IC applicationsBREWER SCIENCE INC·Filed 2015·Granted Nov 28, 2017·6 cites·15 claims
- 0381US8221571B2Cyclic olefin compositions for temporary wafer bondingHONG WENBIN·Filed 2010·Granted Jul 17, 2012·4 cites·11 claims
- 0480US9496164B2Cyclic olefin polymer compositions and polysiloxane release layers for use in temporary wafer bonding processesBREWER SCIENCE INC·Filed 2015·Granted Nov 15, 2016·4 cites·38 claims
- 0573US10968348B2Laser-releasable bonding materials for 3-D IC applicationsBREWER SCIENCE INC·Filed 2018·Granted Apr 6, 2021·2 cites·31 claims
- 0673US8865599B2Self-leveling planarization materials for microelectronic topographyBREWER SCIENCE INC·Filed 2012·Granted Oct 21, 2014·3 cites·27 claims
- 0766US8771442B2Cyclic olefin compositions for temporary wafer bondingHONG WENBIN·Filed 2012·Granted Jul 8, 2014·1 cites·6 claims
- 0864US9865490B2Cyclic olefin polymer compositions and polysiloxane release layers for use in temporary wafer bonding processesBREWER SCIENCE INC·Filed 2016·Granted Jan 9, 2018·1 cites·32 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →