Inventor · disambiguated record
Donald W. Brouillette
Also filed as: BROUILLETTE DONALD W · BROUILLETTE DONALD WALTER
17 granted patents·2 pending applications·416 citations·filing 1996–2011
95Inventor score
Top patents by PatentIndex Score
19 records- 0197US6271102B1Method and system for dicing wafers, and semiconductor structures incorporating the products thereofIBM·Filed 1998·Granted Aug 7, 2001·125 cites·11 claims
- 0293US6368881B1Wafer thickness control during backside grindIBM·Filed 2000·Granted Apr 9, 2002·54 cites·28 claims
- 0385US6887126B2Wafer thickness control during backside grindIBM·Filed 2001·Granted May 3, 2005·25 cites·14 claims
- 0483US6915795B2Method and system for dicing wafers, and semiconductor structures incorporating the products thereofIBM·Filed 2003·Granted Jul 12, 2005·20 cites·11 claims
- 0583US5913125AMethod of controlling stress in a filmIBM·Filed 1996·Granted Jun 15, 1999·68 cites·2 claims
- 0674US6153536AMethod for mounting wafer frame at back side grinding (BSG) toolIBM·Filed 1999·Granted Nov 28, 2000·42 cites·20 claims
- 0768US6888223B2Use of photoresist in substrate vias during backside grindIBM·Filed 2003·Granted May 3, 2005·14 cites·32 claims
- 0863US6600213B2Semiconductor structure and package including a chip having chamfered edgesIBM·Filed 2001·Granted Jul 29, 2003·7 cites·8 claims
- 0963US5888838AMethod and apparatus for preventing chip breakage during semiconductor manufacturing using wafer grinding striation informationIBM·Filed 1998·Granted Mar 30, 1999·25 cites·17 claims
- 1057US7288465B2Semiconductor wafer front side protectionIBM·Filed 2005·Granted Oct 30, 2007·1 cites·9 claims
- 1152US7074715B2Use of photoresist in substrate vias during backside grindIBM·Filed 2004·Granted Jul 11, 2006·5 cites·32 claims
- 1251US7134933B2Wafer thickness control during backside grindIBM·Filed 2005·Granted Nov 14, 2006·0 cites·8 claims
- 1351US6171873B1Method and apparatus for preventing chip breakage during semiconductor manufacturing using wafer grinding striation informationIBM·Filed 1998·Granted Jan 9, 2001·15 cites·5 claims
- 1447US7001827B2Semiconductor wafer front side protectionIBM·Filed 2003·Granted Feb 21, 2006·3 cites·7 claims
- 1547US2008064185A1Semiconductor wafer front side protectionIBM·Filed 2007·Application pending·0 cites
- 1645US6328794B1Method of controlling stress in a filmIBM·Filed 1997·Granted Dec 11, 2001·11 cites·38 claims
- 1744US7902682B2Ultraviolet energy curable tape and method of making a semiconductor chip using the tapeIBM·Filed 2003·Granted Mar 8, 2011·1 cites·22 claims
- 1840US8163602B2Ultraviolet energy curable tape and method of making a semiconductor chip using the tapeKRYWANCZYK TIMOTHY C·Filed 2011·Granted Apr 24, 2012·0 cites·9 claims
- 1926US2002086137A1Method of reducing wafer stress by laser ablation of streetsIBM·Filed 2000·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Donald W. Brouillette files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →