Inventor · disambiguated record
Donald Paul Cunningham
Also filed as: CUNNINGHAM DONALD · CUNNINGHAM DONALD PAUL
14 granted patents·1 pending application·203 citations·filing 2008–2017
92Inventor score
Files withGEN ELECTRIC9KAPUSTA CHRISTOPHER JAMES3GOWDA ARUN VIRUPAKSHA1MCCONNELEE PAUL1MCCONNELEE PAUL ALAN1
Top patents by PatentIndex Score
15 records- 0196US8008125B2System and method for stacked die embedded chip build-upGEN ELECTRIC·Filed 2009·Granted Aug 30, 2011·61 cites·24 claims
- 0295US8276268B2System and method of forming a patterned conformal structureKAPUSTA CHRISTOPHER JAMES·Filed 2008·Granted Oct 2, 2012·38 cites·17 claims
- 0395US7752751B2System and method of forming a low profile conformal shieldGEN ELECTRIC·Filed 2008·Granted Jul 13, 2010·47 cites·18 claims
- 0489US8115117B2System and method of forming isolated conformal shielding areasKAPUSTA CHRISTOPHER JAMES·Filed 2009·Granted Feb 14, 2012·19 cites·25 claims
- 0585US8114708B2System and method for pre-patterned embedded chip build-upMCCONNELEE PAUL·Filed 2008·Granted Feb 14, 2012·24 cites·15 claims
- 0683US8653670B2Electrical interconnect for an integrated circuit package and method of making sameMCCONNELEE PAUL ALAN·Filed 2010·Granted Feb 18, 2014·5 cites·21 claims
- 0774US9299647B2Electrical interconnect for an integrated circuit package and method of making sameGEN ELECTRIC·Filed 2014·Granted Mar 29, 2016·2 cites·30 claims
- 0868US9066443B2Overlay circuit structure for interconnecting light emitting semiconductorsGOWDA ARUN VIRUPAKSHA·Filed 2011·Granted Jun 23, 2015·2 cites·26 claims
- 0968US8748754B2System and method of forming a patterned conformal structureKAPUSTA CHRISTOPHER JAMES·Filed 2011·Granted Jun 10, 2014·2 cites·17 claims
- 1062US9570376B2Electrical interconnect for an integrated circuit package and method of making sameGEN ELECTRIC·Filed 2015·Granted Feb 14, 2017·1 cites·20 claims
- 1161US7952187B2System and method of forming a wafer scale packageGEN ELECTRIC·Filed 2008·Granted May 31, 2011·2 cites·23 claims
- 1258US10068840B2Electrical interconnect for an integrated circuit package and method of making sameGEN ELECTRIC·Filed 2017·Granted Sep 4, 2018·0 cites·27 claims
- 1356US9679837B2Electrical interconnect for an integrated circuit package and method of making sameGEN ELECTRIC·Filed 2016·Granted Jun 13, 2017·0 cites·20 claims
- 1455US10070531B2Overlay circuit structure for interconnecting light emitting semiconductorsGEN ELECTRIC·Filed 2014·Granted Sep 4, 2018·0 cites·25 claims
- 1544US2010244585A1High-temperature capacitors and methods of making the sameGEN ELECTRIC·Filed 2009·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →