Inventor · disambiguated record
Dongjin Jung
Also filed as: JUNG DONGJIN
14 granted patents·4 pending applications·95 citations·filing 2007–2025
90Inventor score
Top patents by PatentIndex Score
18 records- 0193US7989950B2Integrated circuit packaging system having a cavitySTATS CHIPPAC LTD·Filed 2008·Granted Aug 2, 2011·29 cites·10 claims
- 0292US8035210B2Integrated circuit package system with interposerSTATS CHIPPAC LTD·Filed 2007·Granted Oct 11, 2011·27 cites·20 claims
- 0391US8704365B2Integrated circuit packaging system having a cavityPARK DONGSAM·Filed 2011·Granted Apr 22, 2014·13 cites·10 claims
- 0488US7901987B2Package-on-package system with internal stacking module interposerSTATS CHIPPAC LTD·Filed 2008·Granted Mar 8, 2011·19 cites·20 claims
- 0581US11652453B2Tunable baluns for multimode power amplificationSKYWORKS SOLUTIONS INC·Filed 2020·Granted May 16, 2023·1 cites·18 claims
- 0680US2025062731A1Adaptable impedance circuits for amplification systemsSKYWORKS SOLUTIONS INC·Filed 2024·Application pending·0 cites
- 0779US12081181B2Variable-gain amplifiers with configurable balunsSKYWORKS SOLUTIONS INC·Filed 2023·Granted Sep 3, 2024·0 cites·18 claims
- 0875US11211911B2Capacitive-coupled bandpass filterSKYWORKS SOLUTIONS INC·Filed 2020·Granted Dec 28, 2021·1 cites·28 claims
- 0973US2025039329A1Electronic apparatus, controlling method of electronic apparatus, and computer readable mediumSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1068US12142021B2Electronic apparatus, controlling method of electronic apparatus, and computer readable mediumSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Nov 12, 2024·0 cites·15 claims
- 1165US2025323619A1High-power acoustic wave filter package capable of self-heat dissipationSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1264US9865453B2Semiconductor devices including device isolation structures and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jan 9, 2018·1 cites·15 claims
- 1364US7863100B2Integrated circuit packaging system with layered packaging and method of manufacture thereofSTATS CHIPPAC LTD·Filed 2009·Granted Jan 4, 2011·3 cites·20 claims
- 1462US9825142B2Methods of fabricating semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Nov 21, 2017·1 cites·20 claims
- 1553US11558545B2Electronic apparatus, controlling method of electronic apparatus, and computer readable mediumSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jan 17, 2023·0 cites·20 claims
- 1648US12418112B2Antenna structure and electronic device including sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Sep 16, 2025·0 cites·20 claims
- 1745US12388166B2Antenna module and electronic device comprising sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 12, 2025·0 cites·15 claims
- 1845US2025007166A1Electronic device comprising antenna moduleSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →