Inventor · disambiguated record
Do-Heyoung Kim
Also filed as: KIM DO HEYOUNG
4 granted patents·38 citations·filing 1996–2018
73Inventor score
Top patents by PatentIndex Score
4 records- 0167US6372116B1Method of forming a conductive layer and an electroplating apparatus thereofHYUNDAI MICROELECTRONICS CO LT·Filed 1999·Granted Apr 16, 2002·17 cites·2 claims
- 0266US6797135B2Electroplating apparatusHYUNDAI MICROELECTRONICS CO LT·Filed 2002·Granted Sep 28, 2004·4 cites·20 claims
- 0346US5795796AMethod of fabricating metal line structureLG SEMICON CO LTD·Filed 1996·Granted Aug 18, 1998·17 cites·18 claims
- 0445US11434566B2Deposition apparatus capable of applying powder particles, and method for applying powder particlesUNIV NAT CHONNAM IND FOUND·Filed 2018·Granted Sep 6, 2022·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →