Inventor · disambiguated record
Dosun Lee
Also filed as: LEE DOSUN
7 granted patents·4 pending applications·40 citations·filing 2011–2024
83Inventor score
Top patents by PatentIndex Score
11 records- 0193US9530706B2Semiconductor devices having hybrid stacking structures and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Dec 27, 2016·13 cites·17 claims
- 0282US9153559B2Semiconductor devices including through silicon via electrodes and methods of fabricating the sameLEE DOSUN·Filed 2012·Granted Oct 6, 2015·8 cites·19 claims
- 0380US9214374B2Semiconductor devices including stress relief structuresLEE DOSUN·Filed 2012·Granted Dec 15, 2015·10 cites·26 claims
- 0471US8872351B2Semiconductor devices having through electrodesSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Oct 28, 2014·3 cites·6 claims
- 0569US8691692B2Semiconductor chips and methods of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Apr 8, 2014·2 cites·9 claims
- 0669US8551860B2Semiconductor devices having through electrodes and methods of fabricating the sameBANG SUKCHUL·Filed 2012·Granted Oct 8, 2013·3 cites·15 claims
- 0763US8710650B2Semiconductor devices having through electrodes and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Apr 29, 2014·1 cites·11 claims
- 0860US2025374600A1Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0950US2025132249A1Semiconductor device and interconnection structure in semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1046US2017110445A1Semiconductor devices having hybrid stacking structures and methods of fabricating the sameKANG PIL-KYU·Filed 2016·Application pending·0 cites
- 1142US2012119376A1Semiconductor chips and methods of forming the sameLIM DONG-CHAN·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →