Inventor · disambiguated record
Dohyun Lee
Also filed as: LEE DOHYUN
21 granted patents·4 pending applications·76 citations·filing 2007–2024
92Inventor score
Top patents by PatentIndex Score
25 records- 0196US10229927B2Semiconductor device and method of manufacturing the semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Mar 12, 2019·18 cites·15 claims
- 0296US9595346B23-Dimensional semiconductor memory device and operating method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Mar 14, 2017·22 cites·20 claims
- 0391US12075183B2Display control deviceLG ELECTRONICS INC·Filed 2021·Granted Aug 27, 2024·6 cites·19 claims
- 0490US10032789B2Three-dimensional semiconductor memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jul 24, 2018·10 cites·23 claims
- 0590US9875931B2Semiconductor device having interconnection structureLEE DOHYUN·Filed 2016·Granted Jan 23, 2018·7 cites·11 claims
- 0682US8129049B2Jelly-roll having active material layer with different loading amountKIM JONG HEE·Filed 2008·Granted Mar 6, 2012·7 cites·8 claims
- 0779US10418278B2Semiconductor device having interconnection structureLEE DOHYUN·Filed 2017·Granted Sep 17, 2019·2 cites·20 claims
- 0876US10566233B2Semiconductor device having interconnection structureSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 18, 2020·1 cites·20 claims
- 0976US2025107208A1Semiconductor device and electronic apparatus including the semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1074US11869836B2Method for forming a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jan 9, 2024·0 cites·20 claims
- 1169US11581253B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 14, 2023·0 cites·20 claims
- 1269US10707126B2Semiconductor device having interconnection structureSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jul 7, 2020·0 cites·20 claims
- 1367US12357553B2Composition for treating hair loss or promoting hair growth, comprising piperonylic acidHESED BIO CO LTD·Filed 2022·Granted Jul 15, 2025·0 cites·10 claims
- 1467US12199165B2Semiconductor device and electronic apparatus including the semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jan 14, 2025·0 cites·24 claims
- 1565US11152297B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 19, 2021·0 cites·20 claims
- 1665US9299707B2Three-dimensional semiconductor devices with current path selection structureLEE JAEDUK·Filed 2014·Granted Mar 29, 2016·3 cites·26 claims
- 1759US11833504B2Microfluidic label-free isolation and identification of cells using fluorescence lifetime imaging (FLIM)UNIV CALIFORNIA·Filed 2020·Granted Dec 5, 2023·0 cites·15 claims
- 1858US11547737B2Compositions and methods for treating virus infectionNOVMETAPHARMA CO LTD·Filed 2021·Granted Jan 10, 2023·0 cites·20 claims
- 1953US12080797B2Multi-bridge channel field effect transistor with recessed source/drainSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Sep 3, 2024·0 cites·20 claims
- 2051US11439577B2Anti-aging or skin-regenerating composition comprising piperonylic acid as effective ingredientHESED BIO CO LTD·Filed 2018·Granted Sep 13, 2022·0 cites·9 claims
- 2147US2008050655A1Cathode material containing two types of conductive materials and lithium secondary battery comprising the sameLG CHEMICAL LTD·Filed 2007·Application pending·0 cites
- 2245US11090653B2Systems and methods to encapsulate and preserve organic matter for analysisUNIV CALIFORNIA·Filed 2017·Granted Aug 17, 2021·0 cites·20 claims
- 2344US2022304974A1Composition comprising gossypetin for prevention or treatment of neurodegenerative diseaseNOVMETAHEALTH CO LTD·Filed 2020·Application pending·0 cites
- 2442US2017186758A13-dimensional semiconductor memory device and operating method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2017·Application pending·0 cites
- 2539US8791520B2Non-volatile memory devices having a floating gate cap between a floating gate and a gate insulating layerLEE JAEDUK·Filed 2011·Granted Jul 29, 2014·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →