Inventor · disambiguated record
Donald R. Letourneau
Also filed as: LETOURNEAU DONALD R
4 granted patents·1 pending application·16 citations·filing 2011–2015
71Inventor score
Top patents by PatentIndex Score
5 records- 0186US8921975B2System and method for forming aluminum fuse for compatibility with copper BEOL interconnect schemeANDERSON FELIX P·Filed 2012·Granted Dec 30, 2014·8 cites·6 claims
- 0284US10078183B2Waveguide structures used in phonotics chip packagingGLOBALFOUNDRIES INC·Filed 2015·Granted Sep 18, 2018·5 cites·20 claims
- 0367US9553061B1Wiring bond pad structuresGLOBALFOUNDRIES INC·Filed 2015·Granted Jan 24, 2017·2 cites·9 claims
- 0462US8927411B2System and method for forming an aluminum fuse for compatibility with copper BEOL interconnect schemeIBM·Filed 2013·Granted Jan 6, 2015·1 cites·5 claims
- 0537US2012261813A1Reinforced via farm interconnect structure, a method of forming a reinforced via farm interconnect structure and a method of redesigning an integrated circuit chip to include such a reinforced via farm interconnect structureANDERSON FELIX P·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →