Inventor · disambiguated record

Doo Hwan Moon

Also filed as: MOON DOO HWAN

4 granted patents·234 citations·filing 2000–2005

81Inventor score

Technology areasH10W

Files withAMKOR TECHNOLOGY INC4

Top patents by PatentIndex Score

4 records

0193US6521987B1Plastic integrated circuit device package and method for making the packageAMKOR TECHNOLOGY INC·Filed 2000·Granted Feb 18, 2003·104 cites·18 claims
0291US6977431B1Stackable semiconductor package and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2003·Granted Dec 20, 2005·104 cites·24 claims
0386US7214326B1Increased capacity leadframe and semiconductor package using the sameAMKOR TECHNOLOGY INC·Filed 2005·Granted May 8, 2007·17 cites·20 claims
0460US7144517B1Manufacturing method for leadframe and for semiconductor package using the leadframeAMKOR TECHNOLOGY INC·Filed 2003·Granted Dec 5, 2006·9 cites·15 claims

Join the waitlist — get patent alerts

Get an alert when Doo Hwan Moon files or is granted a new patent.

We store only your email — no account needed. See our privacy policy.

Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →