Inventor · disambiguated record
Doau-Tzu Wang
Also filed as: WANG DOAU-TZU
3 granted patents·1 pending application·2 citations·filing 2011–2014
53Inventor score
Top patents by PatentIndex Score
4 records- 0158US8698008B2Packaging substrate and fabrication method thereofYEN LEE-SHENG·Filed 2011·Granted Apr 15, 2014·1 cites·4 claims
- 0252US8628636B2Method of manufacturing a package substrateYEN LEE-SHENG·Filed 2012·Granted Jan 14, 2014·1 cites·10 claims
- 0345US9084341B2Fabrication method of packaging substrateADVANCE MATERIALS CORP·Filed 2014·Granted Jul 14, 2015·0 cites·9 claims
- 0443US2014247570A1Circuit board structure having electronic components embedded therein and method of fabricating the sameUNIMICRON TECHNOLOGY CORP·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →