Inventor · disambiguated record
Dominik Werne
Also filed as: WERNE DOMINIK
2 granted patents·1 pending application·20 citations·filing 2006–2008
58Inventor score
Technology areasH10P
Top patents by PatentIndex Score
3 records- 0179US7597234B2Method for mounting a flip chip on a substrateOERLIKON ASSEMBLY EQUIPMENT AG·Filed 2006·Granted Oct 6, 2009·16 cites·2 claims
- 0262US8166637B2Apparatus for mounting a flip chip on a substrateBLESSING PATRICK·Filed 2008·Granted May 1, 2012·4 cites·4 claims
- 0337US2010019018A1Method And Device For Wetting The Bumps Of A Semiconductor Chip With Soldering FluxBAUMANN DAMIAN·Filed 2007·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Dominik Werne files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →