Inventor · disambiguated record
Dongqing Yang
Also filed as: YANG DONGQING
22 granted patents·8 pending applications·1,311 citations·filing 2009–2025
96Inventor score
Top patents by PatentIndex Score
30 records- 0199US10679870B2Semiconductor processing chamber multistage mixing apparatusAPPLIED MATERIALS INC·Filed 2018·Granted Jun 9, 2020·32 cites·19 claims
- 0298US10699921B2Semiconductor processing chamber multistage mixing apparatusAPPLIED MATERIALS INC·Filed 2019·Granted Jun 30, 2020·32 cites·15 claims
- 0398US9721789B1Saving ion-damaged spacersAPPLIED MATERIALS INC·Filed 2016·Granted Aug 1, 2017·117 cites·18 claims
- 0498US8501629B2Smooth SiConi etch for silicon-containing filmsTANG JING·Filed 2009·Granted Aug 6, 2013·208 cites·22 claims
- 0598US8435902B2Invertable pattern loading with dry etchTANG JING·Filed 2010·Granted May 7, 2013·227 cites·13 claims
- 0697US9659753B2Grooved insulator to reduce leakage currentAPPLIED MATERIALS INC·Filed 2014·Granted May 23, 2017·123 cites·12 claims
- 0797US9064816B2Dry-etch for selective oxidation removalAPPLIED MATERIALS INC·Filed 2013·Granted Jun 23, 2015·188 cites·18 claims
- 0896US8741778B2Uniform dry etch in two stagesYANG DONGQING·Filed 2011·Granted Jun 3, 2014·183 cites·20 claims
- 0995US8475674B2High-temperature selective dry etch having reduced post-etch solid residueTHADANI KIRAN V·Filed 2010·Granted Jul 2, 2013·183 cites·12 claims
- 1089US11915950B2Multi-zone semiconductor substrate supportsAPPLIED MATERIALS INC·Filed 2022·Granted Feb 27, 2024·1 cites·20 claims
- 1187US10134581B2Methods and apparatus for selective dry etchAPPLIED MATERIALS INC·Filed 2017·Granted Nov 20, 2018·4 cites·17 claims
- 1284US10964512B2Semiconductor processing chamber multistage mixing apparatus and methodsAPPLIED MATERIALS INC·Filed 2018·Granted Mar 30, 2021·3 cites·20 claims
- 1383US11276559B2Semiconductor processing chamber for multiple precursor flowAPPLIED MATERIALS INC·Filed 2017·Granted Mar 15, 2022·3 cites·18 claims
- 1479US11417534B2Selective material removalAPPLIED MATERIALS INC·Filed 2018·Granted Aug 16, 2022·2 cites·15 claims
- 1579US2025239445A1Method and apparatus for selective deposition of dielectric filmsAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 1674US11361939B2Semiconductor processing chamber for multiple precursor flowAPPLIED MATERIALS INC·Filed 2019·Granted Jun 14, 2022·1 cites·15 claims
- 1774US11164724B2Seasoning process for establishing a stable process and extending chamber uptime for semiconductor chip processingAPPLIED MATERIALS INC·Filed 2018·Granted Nov 2, 2021·1 cites·13 claims
- 1873US11101136B2Process window widening using coated parts in plasma etch processesAPPLIED MATERIALS INC·Filed 2019·Granted Aug 24, 2021·1 cites·20 claims
- 1972US11276590B2Multi-zone semiconductor substrate supportsAPPLIED MATERIALS INC·Filed 2017·Granted Mar 15, 2022·1 cites·20 claims
- 2072US10297458B2Process window widening using coated parts in plasma etch processesAPPLIED MATERIALS INC·Filed 2017·Granted May 21, 2019·1 cites·20 claims
- 2170US11515179B2Semiconductor processing chamber multistage mixing apparatusAPPLIED MATERIALS INC·Filed 2020·Granted Nov 29, 2022·0 cites·20 claims
- 2264US2021043448A1Method and Apparatus for Selective Deposition of Dielectric FilmsAPPLIED MATERIALS INC·Filed 2020·Application pending·0 cites
- 2363US2024306391A1Contact construction for semiconductor devices with low-dimensional materialsAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 2457US12315736B2Methods of highly selective silicon oxide removalAPPLIED MATERIALS INC·Filed 2022·Granted May 27, 2025·0 cites·20 claims
- 2557US10008366B2Seasoning process for establishing a stable process and extending chamber uptime for semiconductor chip processingAPPLIED MATERIALS INC·Filed 2016·Granted Jun 26, 2018·0 cites·18 claims
- 2657US2025125154A1Oxide quality differentiationAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2757US2025118536A1Microwave high-density plasma for selective etchAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2854US2018211833A1Method And Apparatus For Selective Deposition Of Dielectric FilmsAPPLIED MATERIALS INC·Filed 2018·Application pending·0 cites
- 2945US2015311089A1Dry-etch for selective oxidation removalAPPLIED MATERIALS INC·Filed 2015·Application pending·0 cites
- 3037US2017194430A1Method for fabricating nanowires for horizontal gate all around devices for semiconductor applicationsAPPLIED MATERIALS INC·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →