Inventor · disambiguated record
Dries Dictus
Also filed as: DICTUS DRIES
12 granted patents·7 pending applications·19 citations·filing 2008–2025
85Inventor score
Top patents by PatentIndex Score
19 records- 0196US12346035B2Process tool for dry removal of photoresistLAM RES CORP·Filed 2023·Granted Jul 1, 2025·6 cites·21 claims
- 0289US10106737B2Liquid mixture and method for selectively wet etching silicon germaniumLAM RES AG·Filed 2017·Granted Oct 23, 2018·8 cites·16 claims
- 0377US2025271782A1Process tool for dry removal of photoresistLAM RES CORP·Filed 2025·Application pending·0 cites
- 0476US7824499B2Photon induced cleaning of a reaction chamberIMEC·Filed 2008·Granted Nov 2, 2010·3 cites·11 claims
- 0567US2025271766A1Metal chelators for development of metal-containing photoresistLAM RES CORP·Filed 2025·Application pending·0 cites
- 0667US2025250485A1Photoresist development with organic vaporLAM RES CORP·Filed 2025·Application pending·0 cites
- 0766US2023107357A1Process tool for dry removal of photoresistLAM RES CORP·Filed 2021·Application pending·0 cites
- 0862US11424158B2Metal liner passivation and adhesion enhancement by zinc dopingLAM RES CORP·Filed 2020·Granted Aug 23, 2022·0 cites·32 claims
- 0961US10815573B2Passivation mixture and systems and methods for selectively passivating substrate materials including germanium or type III-IV materials using the passivation mixtureLAM RES AG·Filed 2017·Granted Oct 27, 2020·0 cites·11 claims
- 1061US8114483B2Photon induced formation of metal comprising elongated nanostructuresDICTUS DRIES·Filed 2008·Granted Feb 14, 2012·2 cites·27 claims
- 1155US2023266670A1Metal chelators for development of metal-containing photoresistLAM RES CORP·Filed 2021·Application pending·0 cites
- 1250US11984354B2Zincating and doping of metal liner for liner passivation and adhesion improvementLAM RES CORP·Filed 2019·Granted May 14, 2024·0 cites·20 claims
- 1349US10741440B2Metal liner passivation and adhesion enhancement by zinc dopingLAM RES CORP·Filed 2018·Granted Aug 11, 2020·0 cites·20 claims
- 1449US8524329B2Electroless copper depositionDORDI YEZDI N·Filed 2011·Granted Sep 3, 2013·0 cites·18 claims
- 1545US9142456B2Method for capping copper interconnect linesLAM RES CORP·Filed 2013·Granted Sep 22, 2015·0 cites·15 claims
- 1645US8545595B2Photon induced formation of metal comprising elongated nanostructuresDICTUS DRIES·Filed 2012·Granted Oct 1, 2013·0 cites·22 claims
- 1744US2022299877A1Positive tone development of cvd euv resist filmsLAM RES CORP·Filed 2020·Application pending·0 cites
- 1840US2014154406A1Wet activation of ruthenium containing liner/barrierLAM RES CORP·Filed 2012·Application pending·0 cites
- 1935US11854792B2Systems and methods for preventing stiction of high aspect ratio structures and/or repairing high aspect ratio structuresLAM RES AG·Filed 2018·Granted Dec 26, 2023·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →