Inventor · disambiguated record
Dustin Zachary Austin
Also filed as: AUSTIN DUSTIN ZACHARY
7 granted patents·11 pending applications·3 citations·filing 2018–2023
72Inventor score
Files withLAM RES CORP18
Top patents by PatentIndex Score
18 records- 0182US10840082B2Method to clean SnO2 film from chamberLAM RES CORP·Filed 2018·Granted Nov 17, 2020·3 cites·15 claims
- 0268US12473633B2Plasma enhanced atomic layer deposition of silicon-containing filmsLAM RES CORP·Filed 2022·Granted Nov 18, 2025·0 cites·25 claims
- 0367US11717866B2Etching metal-oxide and protecting chamber componentsLAM RES CORP·Filed 2022·Granted Aug 8, 2023·0 cites·8 claims
- 0458US11915923B2Method to clean SnO2 film from chamberLAM RES CORP·Filed 2020·Granted Feb 27, 2024·0 cites·14 claims
- 0555US12417943B2Reducing intralevel capacitance in semiconductor devicesLAM RES CORP·Filed 2021·Granted Sep 16, 2025·0 cites·20 claims
- 0654US2025197996A1Low-k dielectric protection during plasma deposition of silicon nitrideLAM RES CORP·Filed 2023·Application pending·0 cites
- 0753US2025014890A1Conformal, carbon-doped silicon nitride films and methods thereofLAM RES CORP·Filed 2022·Application pending·0 cites
- 0853US2025062118A1High pressure plasma inhibitionLAM RES CORP·Filed 2022·Application pending·0 cites
- 0952US2025054747A1Conformal deposition of silicon nitrideLAM RES CORP·Filed 2022·Application pending·0 cites
- 1050US12372872B2Extreme ultraviolet (EUV) lithography using an intervening layer or a multi-layer stack with varying mean free paths for secondary electron generationLAM RES CORP·Filed 2020·Granted Jul 29, 2025·0 cites·13 claims
- 1150US2025054752A1Method to smooth sidewall roughness and maintain reentrant structures during dielectric gap fillLAM RES CORP·Filed 2022·Application pending·0 cites
- 1250US2025226227A1Deposition of metal-containing films and chamber cleanLAM RES CORP·Filed 2023·Application pending·0 cites
- 1349US2021308726A1Etching metal-oxide and protecting chamber componentsLAM RES CORP·Filed 2019·Application pending·0 cites
- 1449US2025166989A1Thermal film depositionLAM RES CORP·Filed 2023·Application pending·0 cites
- 1548US2025154644A1High pressure inert oxidation and in-situ annealing process to improve film seam quality and werLAM RES CORP·Filed 2023·Application pending·0 cites
- 1645US11031244B2Modification of SNO2 surface for EUV lithographyLAM RES CORP·Filed 2018·Granted Jun 8, 2021·0 cites·19 claims
- 1745US2023175117A1Seam mitigation and integrated liner for gap fillLAM RES CORP·Filed 2021·Application pending·0 cites
- 1844US2023038880A1Protective coating for a semiconductor reaction chamberLAM RES CORP·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →