Inventor · disambiguated record
Duane Cook
Also filed as: COOK DUANE · COOK DUANE S
7 granted patents·3 pending applications·74 citations·filing 1999–2009
85Inventor score
Top patents by PatentIndex Score
10 records- 0173US7141448B2Controlled collapse chip connection (C4) integrated circuit package which has two dissimilar underfill materialsINTEL CORP·Filed 2001·Granted Nov 28, 2006·17 cites·13 claims
- 0260US6331446B1Process for underfilling a controlled collapse chip connection (C4) integrated circuit package with an underfill material that is heated to a partial gel stateINTEL CORP·Filed 1999·Granted Dec 18, 2001·25 cites·35 claims
- 0357US6945708B2Planar lightwave circuit packageJDS UNIPHASE CORP·Filed 2003·Granted Sep 20, 2005·5 cites·9 claims
- 0456US6907147B2Method and apparatus for aligning and orienting polarization maintaining optical fibersINTEL CORP·Filed 2001·Granted Jun 14, 2005·8 cites·27 claims
- 0556US2010294689A1Spherical Locking ContainerCOOK DUANE S·Filed 2009·Application pending·0 cites
- 0654US7203390B2Planar lightwave circuit packageJDS UNIPHASE CORP·Filed 2005·Granted Apr 10, 2007·1 cites·1 claims
- 0749US6606425B1Transfer molded packages with embedded thermal insulationJDS UNIPHASE CORP·Filed 2002·Granted Aug 12, 2003·2 cites·13 claims
- 0849US6528345B1Process line for underfilling a controlled collapseINTEL CORP·Filed 1999·Granted Mar 4, 2003·16 cites·18 claims
- 0942US2006001310A1Multi-leaded lug bolt for accelerated wheel removal and attachmentCRAFTS DOUGLAS E·Filed 2005·Application pending·0 cites
- 1029US2002014688A1Controlled collapse chip connection (c4) integrated circuit package which has two dissimilar underfill materialsFiled 1999·Application pending·0 cites
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