Inventor · disambiguated record
Dylan Yu
Also filed as: YU DYLAN
1 granted patent·3 pending applications·18 citations·filing 2003–2005
41Inventor score
Top patents by PatentIndex Score
4 records- 0165US7087464B2Method and structure for a wafer level packagingUNITED MICROELECTRONICS CORP·Filed 2004·Granted Aug 8, 2006·18 cites·12 claims
- 0245US2006079022A1Frame attaching processTSENG NENG-YU·Filed 2005·Application pending·0 cites
- 0334US2005102827A1Frame attaching processFiled 2003·Application pending·0 cites
- 0427US2005077603A1Method and structure for a wafer level packagingFiled 2003·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Dylan Yu files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →