Inventor · disambiguated record
Edward Derian
Also filed as: DERIAN EDWARD J
7 granted patents·7 pending applications·347 citations·filing 2001–2010
89Inventor score
Top patents by PatentIndex Score
14 records- 0198US7881072B2System and method for processor power delivery and thermal managementMOLEX INC·Filed 2006·Granted Feb 1, 2011·73 cites·23 claims
- 0288US6618268B2Apparatus for delivering power to high performance electronic assembliesINCEP TECHNOLOGIES INC·Filed 2001·Granted Sep 9, 2003·80 cites·14 claims
- 0387US6847529B2Ultra-low impedance power interconnection system for electronic packagesINCEP TECHNOLOGIES INC·Filed 2001·Granted Jan 25, 2005·42 cites·37 claims
- 0485US6556455B2Ultra-low impedance power interconnection system for electronic packagesINCEP TECHNOLOGIES INC·Filed 2001·Granted Apr 29, 2003·47 cites·27 claims
- 0584US6623279B2Separable power delivery connectorINCEP TECHNOLOGIES INC·Filed 2002·Granted Sep 23, 2003·42 cites·63 claims
- 0681US6801431B2Integrated power delivery and cooling system for high power microprocessorsINCEP TECHNOLOGIES INC·Filed 2002·Granted Oct 5, 2004·36 cites·10 claims
- 0776US7167379B2Micro-spring interconnect systems for low impedance high power applicationsDIBENE II JOSEPH T·Filed 2003·Granted Jan 23, 2007·27 cites·22 claims
- 0854US2010325882A1System And Method For Processor Power Delivery And Thermal ManagementMOLEX INC·Filed 2010·Application pending·0 cites
- 0954US2007268677A1System and method for processor power delivery and thermal managementMOLEX INC·Filed 2007·Application pending·0 cites
- 1047US2005277310A1System and method for processor power delivery and thermal managementMOLEX INC·Filed 2005·Application pending·0 cites
- 1142US2003214800A1System and method for processor power delivery and thermal managementFiled 2003·Application pending·0 cites
- 1235US2001033476A1Thermal/mechanical springbeam mechanism for heat transfer from heat source to heat dissipating deviceFiled 2001·Application pending·0 cites
- 1334US2002015288A1High performance thermal/mechanical interface for fixed-gap references for high heat flux and power semiconductor applicationsFiled 2001·Application pending·0 cites
- 1428US2004043644A1Coaxial and linear power delivery devicesFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →