Inventor · disambiguated record
Edward Fuergut
Also filed as: FUERGUT EDWARD
139 granted patents·23 pending applications·943 citations·filing 2004–2024
99Inventor score
Files withINFINEON TECHNOLOGIES AG98INFINEON TECHNOLOGIES AUSTRIA AG30FUERGUT EDWARD13MAHLER JOACHIM5BRUNNBAUER MARKUS4
Top patents by PatentIndex Score
162 records- 0198US9593009B2Apparatus comprising and a method for manufacturing an embedded MEMS deviceINFINEON TECHNOLOGIES AG·Filed 2014·Granted Mar 14, 2017·46 cites·23 claims
- 0297US9627287B2Thinning in package using separation structure as stopINFINEON TECHNOLOGIES AG·Filed 2013·Granted Apr 18, 2017·153 cites·13 claims
- 0397US7545047B2Semiconductor device with a wiring substrate and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2006·Granted Jun 9, 2009·78 cites·17 claims
- 0496US7202107B2Method for producing a semiconductor component with a plastic housing and carrier plate for performing the methodINFINEON TECHNOLOGIES AG·Filed 2006·Granted Apr 10, 2007·108 cites·9 claims
- 0594US11876028B2Package with electrically insulated carrier and at least one step on encapsulantINFINEON TECHNOLOGIES AG·Filed 2021·Granted Jan 16, 2024·2 cites·20 claims
- 0694US9584889B2System and method for packaged MEMS device having embedding arrangement, MEMS die, and grilleINFINEON TECHNOLOGIES AG·Filed 2013·Granted Feb 28, 2017·17 cites·23 claims
- 0794US7943423B2Reconfigured wafer alignmentINFINEON TECHNOLOGIES AG·Filed 2009·Granted May 17, 2011·28 cites·24 claims
- 0894US7767495B2Method for the fabrication of semiconductor devices including attaching chips to each other with a dielectric materialINFINEON TECHNOLOGIES AG·Filed 2008·Granted Aug 3, 2010·31 cites·21 claims
- 0994US7482198B2Method for producing through-contacts and a semiconductor component with through-contactsINFINEON TECHNOLOGIES AG·Filed 2006·Granted Jan 27, 2009·38 cites·9 claims
- 1093US9837288B2Semiconductor power package and method of manufacturing the sameINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2016·Granted Dec 5, 2017·8 cites·20 claims
- 1193US9355881B2Semiconductor device including a dielectric materialINFINEON TECHNOLOGIES AG·Filed 2014·Granted May 31, 2016·38 cites·22 claims
- 1293US7622733B2Semiconductor structure with a plastic housing and separable carrier plateINFINEON TECHNOLOGIES AG·Filed 2007·Granted Nov 24, 2009·32 cites·18 claims
- 1392US8648456B1Embedded integrated circuit package and method for manufacturing an embedded integrated circuit packageMAHLER JOACHIM·Filed 2012·Granted Feb 11, 2014·13 cites·20 claims
- 1491US11728250B2Semiconductor package with connection lugINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2021·Granted Aug 15, 2023·2 cites·20 claims
- 1591US10418313B2Electronic module comprising a plurality of encapsulation layers and a method for producing itINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2015·Granted Sep 17, 2019·9 cites·14 claims
- 1690US8778733B2Semiconductor package and methods of formation thereofFUERGUT EDWARD·Filed 2012·Granted Jul 15, 2014·11 cites·35 claims
- 1790US7732242B2Composite board with semiconductor chips and plastic housing composition and methodINFINEON TECHNOLOGIES AG·Filed 2007·Granted Jun 8, 2010·22 cites·6 claims
- 1890US7429782B2Semiconductor stack block comprising semiconductor chips and methods for producing the sameINFINEON TECHNOLOGIES AG·Filed 2006·Granted Sep 30, 2008·19 cites·16 claims
- 1989US10347554B2Spatially selective roughening of encapsulant to promote adhesion with functional structureINFINEON TECHNOLOGIES AG·Filed 2017·Granted Jul 9, 2019·7 cites·20 claims
- 2089US7575173B2Smart card, smart card module, and a method for production of a smart card moduleINFINEON TECHNOLOGIES AG·Filed 2006·Granted Aug 18, 2009·22 cites·6 claims
- 2188US9922910B2Functionalized interface structureINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2016·Granted Mar 20, 2018·7 cites·24 claims
- 2287US10256119B2Method of manufacturing a semiconductor power packageINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2017·Granted Apr 9, 2019·4 cites·20 claims
- 2387US10043782B2Electronic device package having a dielectric layer and an encapsulantINFINEON TECHNOLOGIES AG·Filed 2017·Granted Aug 7, 2018·5 cites·12 claims
- 2487US8872288B2Apparatus comprising and a method for manufacturing an embedded MEMS deviceFUERGUT EDWARD·Filed 2012·Granted Oct 28, 2014·7 cites·22 claims
- 2587US8574966B2Semiconductor device having a semiconductor chip, and method for the production thereofBAUER MICHAEL·Filed 2012·Granted Nov 5, 2013·6 cites·9 claims
- 2686US8901739B2Embedded chip package, a chip package, and a method for manufacturing an embedded chip packageINFINEON TECHNOLOGIES AG·Filed 2012·Granted Dec 2, 2014·10 cites·19 claims
- 2785US8692361B2Electric device package comprising a laminate and method of making an electric device package comprising a laminateMAHLER JOACHIM·Filed 2012·Granted Apr 8, 2014·7 cites·17 claims
- 2884US10115646B2Semiconductor arrangement, semiconductor system and method of forming a semiconductor arrangementINFINEON TECHNOLOGIES AG·Filed 2016·Granted Oct 30, 2018·4 cites·26 claims
- 2984US7968378B2Electronic deviceINFINEON TECHNOLOGIES AG·Filed 2008·Granted Jun 28, 2011·13 cites·25 claims
- 3083US9768037B2Electronic device package including metal blocksINFINEON TECHNOLOGIES AG·Filed 2014·Granted Sep 19, 2017·6 cites·7 claims
- 3183US9437513B2Electrically insulating thermal interface on the discontinuity of an encapsulation structureINFINEON TECHNOLOGIES AG·Filed 2014·Granted Sep 6, 2016·5 cites·8 claims
- 3283US7923350B2Method of manufacturing a semiconductor device including etching to etch stop regionsINFINEON TECHNOLOGIES AG·Filed 2008·Granted Apr 12, 2011·8 cites·11 claims
- 3382US11049790B2Electrically insulating thermal interface on the discontinuity of an encapsulation structureINFINEON TECHNOLOGIES AG·Filed 2016·Granted Jun 29, 2021·3 cites·10 claims
- 3482US10435292B2Method for producing a semiconductor moduleINFINEON TECHNOLOGIES AG·Filed 2017·Granted Oct 8, 2019·2 cites·21 claims
- 3582US9040346B2Semiconductor package and methods of formation thereofNIKITIN IVAN·Filed 2012·Granted May 26, 2015·6 cites·20 claims
- 3682US7944061B2Semiconductor device having through contacts through a plastic housing composition and method for the production thereofINFINEON TECHNOLOGIES AG·Filed 2005·Granted May 17, 2011·10 cites·10 claims
- 3782US7091595B2Semiconductor device with semiconductor chip and rewiring layer and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2004·Granted Aug 15, 2006·29 cites·8 claims
- 3881US9455160B2Method for fabricating a semiconductor chip panelINFINEON TECHNOLOGIES AG·Filed 2013·Granted Sep 27, 2016·4 cites·12 claims
- 3980US12094793B2Package with electrically insulated carrier and at least one step on encapsulantINFINEON TECHNOLOGIES AG·Filed 2023·Granted Sep 17, 2024·0 cites·20 claims
- 4080US10373897B2Semiconductor devices with improved thermal and electrical performanceINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2016·Granted Aug 6, 2019·4 cites·8 claims
- 4180US7843055B2Semiconductor device having an adhesion promoting layer and method for producing itINFINEON TECHNOLOGIES AG·Filed 2007·Granted Nov 30, 2010·9 cites·20 claims
- 4279US12438063B2Electronic module including a semiconductor package disposed on an interposer layerINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2024·Granted Oct 7, 2025·0 cites·20 claims
- 4379US11721616B2Semiconductor package with signal distribution elementINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2020·Granted Aug 8, 2023·1 cites·19 claims
- 4479US7935622B2Support with solder ball elements and a method for populating substrates with solder ballsINFINEON TECHNOLOGIES AG·Filed 2005·Granted May 3, 2011·6 cites·6 claims
- 4578US7674654B2Producing thin integrated semiconductor devicesINFINEON TECHNOLOGIES AG·Filed 2007·Granted Mar 9, 2010·8 cites·19 claims
- 4678US2024395646A1Package with electrically insulated carrier and at least one step on encapsulantINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 4777US12463116B2Method for fabricating a semiconductor device including an embedded semiconductor dieINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2024·Granted Nov 4, 2025·0 cites·20 claims
- 4876US2025022872A1Multi-device semiconductor chip with electrical access to devices at either sideINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2024·Application pending·0 cites
- 4975US12261146B2Semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2023·Granted Mar 25, 2025·0 cites·12 claims
- 5075US9966277B2Arrangement and method for manufacturing the sameINFINEON TECHNOLOGIES AG·Filed 2016·Granted May 8, 2018·2 cites·10 claims
Showing the top 50 of 162 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →