Inventor · disambiguated record
Eduard Jan Pabst
Also filed as: PABST EDUARD J · PABST EDUARD JAN
9 granted patents·2 pending applications·45 citations·filing 2013–2024
84Inventor score
Technology areasH10W
Top patents by PatentIndex Score
11 records- 0191US9589909B1Radio frequency and electromagnetic interference shielding in wafer level packaging using redistribution layersFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted Mar 7, 2017·9 cites·12 claims
- 0290US9129981B2Methods for the production of microelectronic packages having radiofrequency stand-off layersYAP WENG F·Filed 2013·Granted Sep 8, 2015·11 cites·20 claims
- 0389US9362234B2Shielded device packages having antennas and related fabrication methodsPABST EDUARD J·Filed 2014·Granted Jun 7, 2016·19 cites·19 claims
- 0482US12184237B2Surface-mount amplifier devicesNXP USA INC·Filed 2021·Granted Dec 31, 2024·1 cites·20 claims
- 0575US9502363B2Wafer level packages and methods for producing wafer level packages having delamination-resistant redistribution layersVINCENT MICHAEL B·Filed 2014·Granted Nov 22, 2016·4 cites·16 claims
- 0674US11329013B2Interconnected substrate arrays containing electrostatic discharge protection grids and associated microelectronic packagesNXP USA INC·Filed 2020·Granted May 10, 2022·1 cites·13 claims
- 0772US12494380B2Amplifier modules with power transistor die and peripheral ground connectionsNXP USA INC·Filed 2024·Granted Dec 9, 2025·0 cites·17 claims
- 0857US11990384B2Amplifier modules with power transistor die and peripheral ground connectionsNXP USA INC·Filed 2020·Granted May 21, 2024·0 cites·13 claims
- 0953US2024120321A1Power amplifier packages containing electrically-routed lids and methods for the fabrication thereofNXP USA INC·Filed 2022·Application pending·0 cites
- 1049US9343414B2Microelectronic packages having radio frequency stand-off layersFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted May 17, 2016·0 cites·20 claims
- 1138US2015108621A1Shielded device packages and related fabrication methodsPABST EDUARD J·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →