Inventor · disambiguated record
Edward Zarbock
Also filed as: ZARBOCK EDWARD · ZARBOCK EDWARD T
3 granted patents·1 pending application·12 citations·filing 2010–2016
62Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0189US8786066B2Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming sameGUZEK JOHN S·Filed 2010·Granted Jul 22, 2014·11 cites·36 claims
- 0266US9617148B2Interposer for hermetic sealing of sensor chips and for their integration with integrated circuit chipsINTEL CORP·Filed 2016·Granted Apr 11, 2017·1 cites·8 claims
- 0353US9406618B2Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming sameINTEL CORP·Filed 2014·Granted Aug 2, 2016·0 cites·32 claims
- 0450US2014327149A1Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming sameGUZEK JOHN S·Filed 2014·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →