Inventor · disambiguated record
Eiichi Ide
Also filed as: IDE EIICHI
42 granted patents·11 pending applications·463 citations·filing 1997–2023
98Inventor score
Files withHITACHI LTD12MINOLTA CO LTD12HITACHI ASTEMO LTD10IDE EIICHI6HITACHI AUTOMOTIVE SYSTEMS LTD5
Top patents by PatentIndex Score
53 records- 0191US8952525B2Semiconductor module and method for manufacturing semiconductor moduleIDE EIICHI·Filed 2011·Granted Feb 10, 2015·23 cites·8 claims
- 0290US9439332B2Power moduleIDE EIICHI·Filed 2012·Granted Sep 6, 2016·15 cites·13 claims
- 0390US6507406B1Three-dimensional data input apparatusMINOLTA CO LTD·Filed 2000·Granted Jan 14, 2003·75 cites·15 claims
- 0488US7955411B2Low temperature bonding material comprising metal particles and bonding methodHITACHI LTD·Filed 2007·Granted Jun 7, 2011·13 cites·22 claims
- 0587US6268918B1Three-dimensional input deviceMINOLTA CO LTD·Filed 1999·Granted Jul 31, 2001·98 cites·28 claims
- 0683US8400777B2Electronic member, electronic part and manufacturing method thereforIDE EIICHI·Filed 2010·Granted Mar 19, 2013·6 cites·6 claims
- 0781US10701842B2Power converter having water passages for cooling power modulesHITACHI LTD·Filed 2015·Granted Jun 30, 2020·2 cites·13 claims
- 0877US9852962B2Waterproof electronic device and manufacturing method thereofHITACHI AUTOMOTIVE SYSTEMS LTD·Filed 2015·Granted Dec 26, 2017·3 cites·10 claims
- 0977US8840811B2Electrically conductive bonding material, method of bonding with the same, and semiconductor device bonded with the sameYASUDA YUUSUKE·Filed 2010·Granted Sep 23, 2014·8 cites·16 claims
- 1077US6812969B2Digital cameraMINOLTA CO LTD·Filed 2003·Granted Nov 2, 2004·16 cites·13 claims
- 1173US10818573B2Power semiconductor module with heat dissipation plateHITACHI AUTOMOTIVE SYSTEMS LTD·Filed 2015·Granted Oct 27, 2020·2 cites·11 claims
- 1273US8821676B2Low temperature bonding material comprising coated metal nanoparticles, and bonding methodYASUDA YUSUKE·Filed 2011·Granted Sep 2, 2014·3 cites·7 claims
- 1371US8513534B2Semiconductor device and bonding materialMORITA TOSHIAKI·Filed 2009·Granted Aug 20, 2013·6 cites·15 claims
- 1470US8821768B2Bonding method and bonding material using metal particleYASUDA YUSUKE·Filed 2007·Granted Sep 2, 2014·5 cites·14 claims
- 1570US6587185B1Distance measuring apparatusMINOLTA CO LTD·Filed 2000·Granted Jul 1, 2003·27 cites·5 claims
- 1670US6556307B1Method and apparatus for inputting three-dimensional dataMINOLTA CO LTD·Filed 1999·Granted Apr 29, 2003·32 cites·60 claims
- 1770US6233049B1Three-dimensional measurement apparatusMINOLTA CO LTD·Filed 1999·Granted May 15, 2001·31 cites·30 claims
- 1869US6975361B2Imaging system, two-dimensional photographing device and three-dimensional measuring deviceMINOLTA CO LTD·Filed 2001·Granted Dec 13, 2005·11 cites·18 claims
- 1968US10064310B2Power-module device, power conversion device, and method for manufacturing power-module deviceHITACHI LTD·Filed 2014·Granted Aug 28, 2018·2 cites·6 claims
- 2068US8912644B2Semiconductor device and method for manufacturing sameHITACHI LTD·Filed 2013·Granted Dec 16, 2014·2 cites·10 claims
- 2168US8592996B2Semiconductor device and method of manufacturing the sameMORITA TOSHIAKI·Filed 2010·Granted Nov 26, 2013·3 cites·19 claims
- 2267US10080313B2Power module and method for manufacturing the sameHITACHI LTD·Filed 2014·Granted Sep 18, 2018·2 cites·14 claims
- 2363US10194563B2Power conversion deviceHITACHI AUTOMOTIVE SYSTEMS LTD·Filed 2015·Granted Jan 29, 2019·1 cites·11 claims
- 2461US9870974B2Power conversion apparatus including wedge insertsHITACHI LTD·Filed 2014·Granted Jan 16, 2018·1 cites·11 claims
- 2560US9591789B2Power semiconductor module and power moduleHITACHI AUTOMOTIVE SYSTEMS LTD·Filed 2012·Granted Mar 7, 2017·1 cites·11 claims
- 2659US8847374B2Power semiconductor module and manufacturing method thereofIDE EIICHI·Filed 2011·Granted Sep 30, 2014·1 cites·3 claims
- 2759US6882435B2Three-dimensional data input apparatusMINOLTA CO LTD·Filed 2003·Granted Apr 19, 2005·10 cites·7 claims
- 2858US9076780B2Power module and lead frame for power moduleNEGISHI YOSHINORI·Filed 2011·Granted Jul 7, 2015·1 cites·12 claims
- 2958US8008772B2Semiconductor device, manufacturing method thereof, composite metal body and manufacturing method thereofHITACHI LTD·Filed 2008·Granted Aug 30, 2011·1 cites·17 claims
- 3056US2025167059A1Power conversion deviceHITACHI ASTEMO LTD·Filed 2023·Application pending·0 cites
- 3155US7027641B2Three-dimensional shape measuring systemMINOLTA CO LTD·Filed 2000·Granted Apr 11, 2006·11 cites·16 claims
- 3255US2025006566A1Semiconductor module, power conversion device, and method for manufacturing semiconductor moduleHITACHI ASTEMO LTD·Filed 2022·Application pending·0 cites
- 3354US12283536B2Power semiconductor device and manufacturing method of power semiconductor deviceHITACHI ASTEMO LTD·Filed 2020·Granted Apr 22, 2025·0 cites·12 claims
- 3453US12095382B2Semiconductor device, electric power conversion device, and manufacturing method of semiconductor deviceHITACHI LTD·Filed 2020·Granted Sep 17, 2024·0 cites·9 claims
- 3552US6049385AThree dimensional measurement system and pickup apparatusMINOLTA CO LTD·Filed 1997·Granted Apr 11, 2000·26 cites·12 claims
- 3652US2024282665A1Power semiconductor deviceHITACHI ASTEMO LTD·Filed 2022·Application pending·0 cites
- 3750US12132014B2Power semiconductor apparatusHITACHI LTD·Filed 2020·Granted Oct 29, 2024·0 cites·6 claims
- 3850US11967584B2Power semiconductor deviceHITACHI ASTEMO LTD·Filed 2019·Granted Apr 23, 2024·0 cites·13 claims
- 3950US2024038611A1Electrical Circuit Body, Power Converter, and Electrical Circuit Body Manufacturing MethodHITACHI ASTEMO LTD·Filed 2021·Application pending·0 cites
- 4050US2024014088A1Power semiconductor deviceHITACHI POWER SEMICONDUCTOR DEVICE LTD·Filed 2021·Application pending·0 cites
- 4149US12506046B2Electric circuit body, power converter, and method for manufacturing electric circuit bodyHITACHI ASTEMO LTD·Filed 2020·Granted Dec 23, 2025·0 cites·9 claims
- 4249US2023059509A1Power Conversion Device and Mechatronic Power Conversion DeviceHITACHI ASTEMO LTD·Filed 2020·Application pending·0 cites
- 4349US2008160183A1Conductive sintered layer forming composition and conductive coating film forming method and bonding method using the sameIDE EIICHI·Filed 2007·Application pending·0 cites
- 4448US2013119322A1Conductive sintered layer forming compositionIDE EIICHI·Filed 2013·Application pending·0 cites
- 4547US12407269B2Semiconductor device, busbar, and power converterHITACHI ASTEMO LTD·Filed 2021·Granted Sep 2, 2025·0 cites·5 claims
- 4647US2022394881A1In-vehicle electronic control deviceHITACHI ASTEMO LTD·Filed 2020·Application pending·0 cites
- 4747US2012104618A1Low temperature bonding material and bonding methodYASUDA YUSUKE·Filed 2012·Application pending·0 cites
- 4846US6172755B1Three dimensional measurement system and pickup apparatusMINOLTA CO LTD·Filed 1999·Granted Jan 9, 2001·19 cites·6 claims
- 4945US9530722B2Semiconductor device and production method for sameHITACHI AUTOMOTIVE SYSTEMS LTD·Filed 2013·Granted Dec 27, 2016·0 cites·3 claims
- 5044US2017084515A1Power-Module Device and Power Conversion DeviceHITACHI LTD·Filed 2014·Application pending·0 cites
Showing the top 50 of 53 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →