Inventor · disambiguated record
Eiichi Komori
Also filed as: KOMORI EIICHI
14 granted patents·11 pending applications·22 citations·filing 2007–2023
86Inventor score
Top patents by PatentIndex Score
25 records- 0189US10612143B2Raw material gas supply apparatus and film forming apparatusTOKYO ELECTRON LTD·Filed 2016·Granted Apr 7, 2020·4 cites·10 claims
- 0287US10036090B2Trap mechanism, exhaust system, and film formation deviceTOKYO ELECTRON LTD·Filed 2013·Granted Jul 31, 2018·10 cites·17 claims
- 0378US10094019B2Film forming apparatusTOKYO ELECTRON LTD·Filed 2013·Granted Oct 9, 2018·4 cites·9 claims
- 0472US9390933B2Etching method, storage medium and etching apparatusTOKYO ELECTRON LTD·Filed 2014·Granted Jul 12, 2016·3 cites·11 claims
- 0570US11286563B2Substrate processing apparatus, substrate processing system, and substrate processing methodTOKYO ELECTRON LTD·Filed 2019·Granted Mar 29, 2022·1 cites·10 claims
- 0660US2023087577A1Substrate processing apparatus and substrate processing methodTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
- 0758US12152298B2Powder conveying apparatus, gas supply apparatus, and method for removing powderTOKYO ELECTRON LTD·Filed 2021·Granted Nov 26, 2024·0 cites·11 claims
- 0858US12018368B2Powder transfer apparatus, gas supply apparatus, and powder removal methodTOKYO ELECTRON LTD·Filed 2022·Granted Jun 25, 2024·0 cites·5 claims
- 0957US2024263305A1Raw material gas supply system, powder raw material replenishing mechanism, and powder raw material replenishing methodTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
- 1056US12503763B2Substrate processing apparatus and substrate processing methodTOKYO ELECTRON LTD·Filed 2022·Granted Dec 23, 2025·0 cites·7 claims
- 1156US11965242B2Raw material supply apparatus and raw material supply methodTOKYO ELECTRON LTD·Filed 2020·Granted Apr 23, 2024·0 cites·9 claims
- 1256US2023238255A1Pressure adjusting valve and semiconductor manufacturing apparatusTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 1353US11506321B2Pipe heating device and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2019·Granted Nov 22, 2022·0 cites·12 claims
- 1453US2023311023A1Raw material supply device and raw material supply methodTOKYO ELECTRON LTD·Filed 2021·Application pending·0 cites
- 1552US2023167551A1Ozone supply system, substrate processing apparatus, and ozone supply methodTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
- 1652US2023311145A1Raw material supply device and raw material supply methodTOKYO ELECTRON LTD·Filed 2021·Application pending·0 cites
- 1750US2024367129A1Feedstock supply deviceTOKYO ELECTRONIC LTD·Filed 2022·Application pending·0 cites
- 1849US2024093751A1Bumper cap and shock absorberHITACHI ASTEMO LTD·Filed 2022·Application pending·0 cites
- 1947US10526702B2Film forming apparatusTOKYO ELECTRON LTD·Filed 2016·Granted Jan 7, 2020·0 cites·4 claims
- 2046US2022341038A1Raw material supply apparatus and raw material supply methodTOKYO ELECTRON LTD·Filed 2020·Application pending·0 cites
- 2145US11306847B2Valve device, processing apparatus, and control methodTOKYO ELECTRON LTD·Filed 2019·Granted Apr 19, 2022·0 cites·9 claims
- 2245US2022396873A1Raw material gas supply system and raw material gas supply methodTOKYO ELECTRON LTD·Filed 2020·Application pending·0 cites
- 2340US11193205B2Source material containerTOKYO ELECTRON LTD·Filed 2018·Granted Dec 7, 2021·0 cites·7 claims
- 2433US2010037959A1Method for supplying process gas, system for supplying process gas, and system for processing object to be processedKAMAISHI TAKAYUKI·Filed 2007·Application pending·0 cites
- 2532US11236425B2Method of processing substrateTOKYO ELECTRON LTD·Filed 2018·Granted Feb 1, 2022·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →