Inventor · disambiguated record
Eiichi Kondoh
Also filed as: KONDOH EIICHI
12 granted patents·11 pending applications·373 citations·filing 1990–2014
92Inventor score
Top patents by PatentIndex Score
23 records- 0190US5627102AMethod for making metal interconnection with chlorine plasma etchKAWASAKI STEEL CO·Filed 1995·Granted May 6, 1997·89 cites·23 claims
- 0280US6063703AMethod for making metal interconnectionKAWASAKI STEEL CO·Filed 1998·Granted May 16, 2000·49 cites·54 claims
- 0380US5973402AMetal interconnection and method for makingKAWASAKI STEEL CO·Filed 1997·Granted Oct 26, 1999·48 cites·20 claims
- 0479US5209182AChemical vapor deposition apparatus for forming thin filmKAWASAKI STEEL CO·Filed 1992·Granted May 11, 1993·49 cites·7 claims
- 0575US5952723ASemiconductor device having a multilevel interconnection structureKAWASAKI STEEL CO·Filed 1997·Granted Sep 14, 1999·42 cites·33 claims
- 0667US7450580B2Application layer multicast system and intermediate node thereforNEC CORP·Filed 2002·Granted Nov 11, 2008·17 cites·8 claims
- 0767US5552181AMethod for supplying liquid material and process for forming thin films using the liquid material supplying methodKAWASAKI STEEL CO·Filed 1993·Granted Sep 3, 1996·29 cites·16 claims
- 0862US5225245AChemical vapor deposition method for forming thin filmKAWASAKI STEEL CO·Filed 1990·Granted Jul 6, 1993·23 cites·3 claims
- 0961US5637534AMethod of manufacturing semiconductor device having multilevel interconnection structureKAWASAKI STEEL CO·Filed 1993·Granted Jun 10, 1997·26 cites·64 claims
- 1053US2007134602A1High-pressure processing apparatusMATSUMOTO KENJI·Filed 2006·Application pending·0 cites
- 1148US2015211100A1Method for forming copper-based film and material for forming copper-based filmGAS PHASE GROWTH LTD·Filed 2014·Application pending·0 cites
- 1247US2008206949A1Apparatus for forming conductor, method for forming conductor, and method for manufacturing semiconductor deviceSEMICONDUCTOR TECH ACAD RES CT·Filed 2007·Application pending·0 cites
- 1344US2005260846A1Substrate processing method, semiconductor device production method, and semiconductor deviceKONDOH EIICHI·Filed 2005·Application pending·0 cites
- 1443US7476619B2Semiconductor deviceTOKYO ELECTRON LTD·Filed 2003·Granted Jan 13, 2009·1 cites·21 claims
- 1542US7892975B2Method for selectively forming electric conductor and method for manufacturing semiconductor deviceSEMICONDUCTOR TECH ACAD RES CT·Filed 2007·Granted Feb 22, 2011·0 cites·24 claims
- 1642US2010112776A1Apparatus for forming conductor, method for forming conductor, and method for manufacturing semiconductor deviceSEMICONDUCTOR TECH ACAD RES CT·Filed 2010·Application pending·0 cites
- 1741US2014193573A1Apparatus of forming electroconductive substance and method of forming the sameFUJIKURA LTD·Filed 2014·Application pending·0 cites
- 1840US7651671B2Method of adding low-pressure gas continuously to supercritical fluid and apparatus thereforUNIV YAMANASHI NAT UNIV CORP·Filed 2005·Granted Jan 26, 2010·0 cites·10 claims
- 1939US2006206608A1User terminal management apparatus, user terminal management program, and user terminal management systemNEC CORP·Filed 2006·Application pending·0 cites
- 2039US2006084266A1Film formation methodEIICHI KONDOH·Filed 2005·Application pending·0 cites
- 2138US2005158477A1Deposition apparatus and a deposition method using medium in a supercritical stateEIICHI KONDOH·Filed 2004·Application pending·0 cites
- 2238US2006121307A1Film deposition methodEIICHI KONDOH·Filed 2005·Application pending·0 cites
- 2335US2006099348A1Deposition methodEIICHI KONDOH·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →