Inventor · disambiguated record
Eiichi Sekimoto
Also filed as: SEKIMOTO EIICHI
12 granted patents·106 citations·filing 1999–2019
89Inventor score
Technology areasH10P
Top patents by PatentIndex Score
12 records- 0179US7868270B2Temperature control for performing heat process in coating/developing system for resist filmTOKYO ELECTRON LTD·Filed 2008·Granted Jan 11, 2011·7 cites·18 claims
- 0276US11612017B2Substrate processing apparatus and substrate processing methodTOKYO ELECTRON LTD·Filed 2019·Granted Mar 21, 2023·2 cites·9 claims
- 0375US11469116B2Substrate processing apparatus and substrate processing methodTOYKO ELECTRON LTD·Filed 2019·Granted Oct 11, 2022·3 cites·9 claims
- 0474US6659661B2Substrate processing apparatusTOKYO ELECTRON LTD·Filed 2002·Granted Dec 9, 2003·18 cites·11 claims
- 0574US6573031B2Apparatus and method of thermal processing and method of pattern formationTOKYO ELECTRON LTD·Filed 2001·Granted Jun 3, 2003·24 cites·22 claims
- 0673US7755003B2Temperature control for performing heat process on resist filmTOKYO ELECTRON LTD·Filed 2007·Granted Jul 13, 2010·5 cites·17 claims
- 0773US6185370B1Heating apparatus for heating an object to be processedTOKYO ELECTRON LTD·Filed 1999·Granted Feb 6, 2001·44 cites·32 claims
- 0865US7517217B2Method and apparatus for heat processing of substrateTOKYO ELECTRON LTD·Filed 2005·Granted Apr 14, 2009·2 cites·3 claims
- 0953US11476136B2Substrate processing apparatus and method of adjusting substrate processing apparatusTOKYO ELECTRON LTD·Filed 2019·Granted Oct 18, 2022·0 cites·3 claims
- 1046US10504757B2Substrate processing apparatus and method of adjusting substrate processing apparatusTOKYO ELECTRON LTD·Filed 2016·Granted Dec 10, 2019·0 cites·4 claims
- 1145US6969538B2Method for heat processing of substrateTOKYO ELECTRON LTD·Filed 2001·Granted Nov 29, 2005·1 cites·8 claims
- 1230US11087983B2Thermal treatment apparatus, thermal treatment method, and non-transitory computer storage mediumTOKYO ELECTRON LTD·Filed 2017·Granted Aug 10, 2021·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →