Inventor · disambiguated record
Eiji Toyoda
Also filed as: TOYODA EIJI
47 granted patents·21 pending applications·421 citations·filing 1975–2021
98Inventor score
Top patents by PatentIndex Score
68 records- 0196US7923314B2Field effect transistor and method for manufacturing the sameTOSHIBA KK·Filed 2008·Granted Apr 12, 2011·39 cites·9 claims
- 0294US8389347B2Field effect transistor and method for manufacturing the sameTEZUKA TSUTOMU·Filed 2011·Granted Mar 5, 2013·18 cites·9 claims
- 0393US5038065APermanent magnet reversible synchronous motorHITACHI LTD·Filed 1989·Granted Aug 6, 1991·93 cites·11 claims
- 0491US4002151ADiesel engine and method for improving the performance thereofTOYOTA MOTOR CO LTD·Filed 1975·Granted Jan 11, 1977·43 cites·17 claims
- 0590US9131829B2Label sheet for cleaning and conveying member having cleaning functionNITTO DENKO CORP·Filed 2014·Granted Sep 15, 2015·8 cites·5 claims
- 0689US8304817B2Field effect transistor and method for manufacturing the sameTEZUKA TSUTOMU·Filed 2011·Granted Nov 6, 2012·9 cites·2 claims
- 0787US10194861B2Wired circuit boardNITTO DENKO CORP·Filed 2016·Granted Feb 5, 2019·5 cites·8 claims
- 0886US9466994B2Mobile terminal power receiving module utilizing wireless power transmission and mobile terminal rechargeable battery including mobile terminal power receiving moduleNITTO DENKO CORP·Filed 2012·Granted Oct 11, 2016·8 cites·10 claims
- 0980US9659883B2Thermally curable resin sheet for sealing semiconductor chip, and method for manufacturing semiconductor packageNITTO DENKO CORP·Filed 2014·Granted May 23, 2017·2 cites·11 claims
- 1078US6821620B2Cleaning sheet, conveying member using the same, and substrate processing equipment cleaning method using themNITTO DENKO CORP·Filed 2001·Granted Nov 23, 2004·20 cites·19 claims
- 1177US8580619B2Method for producing semiconductor deviceNITTO DENKO CORP·Filed 2012·Granted Nov 12, 2013·3 cites·7 claims
- 1277US5151637ADeceleration apparatus for motor and drive circuit for use in motor deceleration apparatus or control apparatus for use in sewing machineHITACHI LTD·Filed 1990·Granted Sep 29, 1992·44 cites·16 claims
- 1373US7501711B2Epoxy resin composition for semiconductor encapsulation and semiconductor device using the sameNITTO DENKO CORP·Filed 2005·Granted Mar 10, 2009·7 cites·3 claims
- 1473US6602599B1Low-staining adhesive sheets and method for removing resist materialNITTO DENKO CORP·Filed 2000·Granted Aug 5, 2003·15 cites·8 claims
- 1570US11837377B2Electrically conductive composition and biosensorNITTO DENKO CORP·Filed 2021·Granted Dec 5, 2023·0 cites·5 claims
- 1669US7977219B2Manufacturing method for silicon waferCOVALENT MATERIALS CORP·Filed 2009·Granted Jul 12, 2011·3 cites·5 claims
- 1767US8912669B2Sealing resin sheet, method for producing electronic component package and electronic component packageNITTO DENKO CORP·Filed 2013·Granted Dec 16, 2014·2 cites·10 claims
- 1866US7713356B2Cleaning sheet, conveying member using the same, and substrate processing equipment cleaning method using themNITTO DENKO CORP·Filed 2001·Granted May 11, 2010·7 cites·16 claims
- 1965US8298872B2Manufacturing method for semiconductor deviceODA TAKASHI·Filed 2010·Granted Oct 30, 2012·2 cites·8 claims
- 2065US2008286562A1Thermosetting encapsulation adhesive sheetNITTO DENKO CORP·Filed 2008·Application pending·0 cites
- 2164US8922031B2Thermosetting encapsulation adhesive sheetTOYODA EIJI·Filed 2012·Granted Dec 30, 2014·2 cites·2 claims
- 2263US8476149B2Method of manufacturing single crystal silicon wafer from ingot grown by Czocharlski process with rapid heating/cooling processISOGAI HIROMICHI·Filed 2009·Granted Jul 2, 2013·3 cites·10 claims
- 2362US7793668B2Cleaning sheet, conveying member using the same, and substrate processing equipment cleaning method using themNITTO DENKO CORP·Filed 2004·Granted Sep 14, 2010·5 cites·18 claims
- 2462US6652700B1Organic electroluminescence device and method for producing the sameNITTO DENKO CORP·Filed 2000·Granted Nov 25, 2003·10 cites·5 claims
- 2559US11217360B2Electrically conductive composition and biosensorNITTO DENKO CORP·Filed 2018·Granted Jan 4, 2022·0 cites·5 claims
- 2658US2013139874A1Conductive adhesive sheet, method for producing the same, collector electrode, and solar cell moduleNITTO DENKO CORP·Filed 2012·Application pending·0 cites
- 2756US6235144B1Resist removing apparatus and methodNITTO DENKO CORP·Filed 1998·Granted May 22, 2001·21 cites·13 claims
- 2855US7846258B2Cleaning sheet and method of cleaning substrate processing equipmentNITTO DENKO CORP·Filed 2003·Granted Dec 7, 2010·4 cites·14 claims
- 2955US7615288B2Cleaning member and cleaning methodNITTO DENKO CORP·Filed 2004·Granted Nov 10, 2009·4 cites·3 claims
- 3054US6245188B1Process for the removal of resist materialNITTO DENKO CORP·Filed 1999·Granted Jun 12, 2001·12 cites·6 claims
- 3153US8906746B2Method for producing semiconductor deviceNITTO DENKO CORP·Filed 2013·Granted Dec 9, 2014·0 cites·6 claims
- 3252US10297470B2Resin sheet for sealing electronic device and method for manufacturing electronic-device packageNITTO DENKO CORP·Filed 2014·Granted May 21, 2019·0 cites·12 claims
- 3351US2010319151A1Cleaning sheet, conveying member using the same, and substrate processing equipment cleaning method using themNITTO DENKKO CORP·Filed 2010·Application pending·0 cites
- 3451US2011229675A1Label sheet for cleaning and conveying member having cleaning functionNITTO DENKO CORP·Filed 2011·Application pending·0 cites
- 3551US2011229697A1Label sheet for cleaning and conveying member having cleaning functionNITTO DENKO CORP·Filed 2011·Application pending·0 cites
- 3650US6638864B2Method for removing resist materialNITTO DENKO CORP·Filed 2002·Granted Oct 28, 2003·3 cites·10 claims
- 3749US11510623B2Patchable biosensorNITTO DENKO CORP·Filed 2018·Granted Nov 29, 2022·0 cites·3 claims
- 3848US11090405B2Laminate patchable to living bodyNITTO DENKO CORP·Filed 2017·Granted Aug 17, 2021·0 cites·4 claims
- 3947US4713722ASuperconducting system and method for controlling the sameTOSHIBA KK·Filed 1986·Granted Dec 15, 1987·8 cites·16 claims
- 4047US2014106133A1LaminateNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 4146US2002100553A1Adhesive tape and process for removing resistNITTO DENKO CORP·Filed 2002·Application pending·0 cites
- 4246US2006105164A1Cleaning sheet, conveying member using the same, and substrate processing equipment cleaning method using themNITTO DENKO CORP·Filed 2005·Application pending·0 cites
- 4345US11576819B2Laminate patchable to living bodyNITTO DENKO CORP·Filed 2017·Granted Feb 14, 2023·0 cites·8 claims
- 4444US8269213B2Epoxy resin composition for semiconductor encapsulation and semiconductor device produced by using the sameNORO HIROSHI·Filed 2008·Granted Sep 18, 2012·0 cites·6 claims
- 4544US2008164572A1Semiconductor substrate and manufacturing method thereofCOVALENT MATERIALS CORP·Filed 2007·Application pending·0 cites
- 4644US2009004825A1Method of manufacturing semiconductor substrateCOVALENT MATERIALS CORP·Filed 2008·Application pending·0 cites
- 4743US11006530B2Producing method of wired circuit boardNITTO DENKO CORP·Filed 2016·Granted May 11, 2021·0 cites·6 claims
- 4843US2016060450A1Sealing sheet, method for manufacturing sealing sheet, and method for manufacturing electronic component packageNITTO DENKO CORP·Filed 2014·Application pending·0 cites
- 4942US6099675AResist removing methodNITTO DENKO CORP·Filed 1998·Granted Aug 8, 2000·8 cites·20 claims
- 5042US6040110AProcess and apparatus for the removal of resistNITTO DENKO CORP·Filed 1998·Granted Mar 21, 2000·12 cites·12 claims
Showing the top 50 of 68 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →