Inventor · disambiguated record
Eliot K. Broadbent
Also filed as: BROADBENT ELIOT · BROADBENT ELIOT K
32 granted patents·3,080 citations·filing 1982–2013
98Inventor score
Files withNOVELLUS SYSTEMS INC24SIGNETICS CORP3NAT SEMICONDUCTOR CORP2NORTH AMERICAN PHILIPS CORP SI2PATTON EVAN E1
Top patents by PatentIndex Score
32 records- 0198US6074544AMethod of electroplating semiconductor wafer using variable currents and mass transfer to obtain uniform plated layerNOVELLUS SYSTEMS INC·Filed 1998·Granted Jun 13, 2000·288 cites·7 claims
- 0298US6027631AElectroplating system with shields for varying thickness profile of deposited layerNOVELLUS SYSTEMS INC·Filed 1997·Granted Feb 22, 2000·318 cites·3 claims
- 0398US5405480AInduction plasma sourceNOVELLUS SYSTEMS INC·Filed 1994·Granted Apr 11, 1995·162 cites·31 claims
- 0497US6110346AMethod of electroplating semicoductor wafer using variable currents and mass transfer to obtain uniform plated layerNOVELLUS SYSTEMS INC·Filed 1999·Granted Aug 29, 2000·158 cites·9 claims
- 0597US5346578AInduction plasma sourceNOVELLUS SYSTEMS INC·Filed 1992·Granted Sep 13, 1994·242 cites·25 claims
- 0697US5238499AGas-based substrate protection during processingNOVELLUS SYSTEMS INC·Filed 1991·Granted Aug 24, 1993·411 cites·23 claims
- 0795US6162344AMethod of electroplating semiconductor wafer using variable currents and mass transfer to obtain uniform plated layerNOVELLUS SYSTEMS INC·Filed 1999·Granted Dec 19, 2000·179 cites·9 claims
- 0894US6554914B1Passivation of copper in dual damascene metalizationNOVELLUS SYSTEMS INC·Filed 2001·Granted Apr 29, 2003·62 cites·27 claims
- 0992US5188717ASweeping method and magnet track apparatus for magnetron sputteringNOVELLUS SYSTEMS INC·Filed 1991·Granted Feb 23, 1993·79 cites·21 claims
- 1091US7189647B2Sequential station tool for wet processing of semiconductor wafersNOVELLUS SYSTEMS INC·Filed 2003·Granted Mar 13, 2007·41 cites·13 claims
- 1191US5171415ACooling method and apparatus for magnetron sputteringNOVELLUS SYSTEMS INC·Filed 1990·Granted Dec 15, 1992·70 cites·31 claims
- 1291US5063175AMethod for manufacturing a planar electrical interconnection utilizing isotropic deposition of conductive materialNORTH AMERICAN PHILIPS CORP SI·Filed 1988·Granted Nov 5, 1991·69 cites·30 claims
- 1390US5230741AGas-based backside protection during substrate processingNOVELLUS SYSTEMS INC·Filed 1990·Granted Jul 27, 1993·118 cites·34 claims
- 1489US5882417AApparatus for preventing deposition on frontside peripheral region and edge of wafer in chemical vapor deposition apparatusNOVELLUS SYSTEMS INC·Filed 1996·Granted Mar 16, 1999·90 cites·2 claims
- 1588US6709565B2Method and apparatus for uniform electropolishing of damascene ic structures by selective agitationNOVELLUS SYSTEMS INC·Filed 2001·Granted Mar 23, 2004·42 cites·59 claims
- 1688US5620525AApparatus for supporting a substrate and introducing gas flow doximate to an edge of the substrateNOVELLUS SYSTEMS INC·Filed 1994·Granted Apr 15, 1997·114 cites·47 claims
- 1787US5133284AGas-based backside protection during substrate processingNAT SEMICONDUCTOR CORP·Filed 1990·Granted Jul 28, 1992·111 cites·5 claims
- 1885US5925411AGas-based substrate deposition protectionNOVELLUS SYSTEMS INC·Filed 1995·Granted Jul 20, 1999·72 cites·37 claims
- 1985US5578532AWafer surface protection in a gas deposition processNOVELLUS SYSTEMS INC·Filed 1994·Granted Nov 26, 1996·91 cites·20 claims
- 2081US8883640B1Sequential station tool for wet processing of semiconductor wafersNOVELLUS SYSTEMS INC·Filed 2013·Granted Nov 11, 2014·3 cites·17 claims
- 2181US5843233AExclusion guard and gas-based substrate protection for chemical vapor deposition apparatusNOVELLUS SYSTEMS INC·Filed 1995·Granted Dec 1, 1998·51 cites·13 claims
- 2280US8450210B1Sequential station tool for wet processing of semiconductor wafersPATTON EVAN E·Filed 2011·Granted May 28, 2013·5 cites·16 claims
- 2380US5769951AExclusion guard and gas-based substrate protection for chemical vapor deposition apparatusNOVELLUS SYSTEMS INC·Filed 1996·Granted Jun 23, 1998·51 cites·8 claims
- 2479US5679405AMethod for preventing substrate backside deposition during a chemical vapor deposition operationNAT SEMICONDUCTOR CORP·Filed 1995·Granted Oct 21, 1997·54 cites·15 claims
- 2578US5374594AGas-based backside protection during substrate processingNOVELLUS SYSTEMS INC·Filed 1993·Granted Dec 20, 1994·56 cites·16 claims
- 2678US4517225AMethod for manufacturing an electrical interconnection by selective tungsten depositionSIGNETICS CORP·Filed 1983·Granted May 14, 1985·42 cites·24 claims
- 2775US8026174B1Sequential station tool for wet processing of semiconductor wafersNOVELLUS SYSTEMS INC·Filed 2009·Granted Sep 27, 2011·3 cites·20 claims
- 2875US6225744B1Plasma process apparatus for integrated circuit fabrication having dome-shaped induction coilNOVELLUS SYSTEMS INC·Filed 1997·Granted May 1, 2001·27 cites·11 claims
- 2960US4976809AMethod of forming an aluminum conductor with highly oriented grain structureNORTH AMERICAN PHILIPS CORP SI·Filed 1989·Granted Dec 11, 1990·25 cites·5 claims
- 3060US4495221AVariable rate semiconductor deposition processSIGNETICS CORP·Filed 1982·Granted Jan 22, 1985·22 cites·10 claims
- 3152US5605599AMethod of generating plasma having high ion density for substrate processing operationNOVELLUS SYSTEMS INC·Filed 1995·Granted Feb 25, 1997·18 cites·10 claims
- 3237US4612257AElectrical interconnection for semiconductor integrated circuitsSIGNETICS CORP·Filed 1984·Granted Sep 16, 1986·6 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →