Inventor · disambiguated record
Eli Dagan
Also filed as: DAGAN ELI
10 granted patents·2 pending applications·2 citations·filing 2019–2024
78Inventor score
Files withAPPLIED MATERIALS INC12
Top patents by PatentIndex Score
12 records- 0173US10710358B2Photomask pellicle glue residue removalAPPLIED MATERIALS INC·Filed 2019·Granted Jul 14, 2020·1 cites·20 claims
- 0272US2024226358A1Atomic oxygen and ozone cleaning device having a temperature control apparatusAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 0371US11114350B2Method for removing photoresist from photomask substrateAPPLIED MATERIALS INC·Filed 2019·Granted Sep 7, 2021·1 cites·15 claims
- 0462US11964068B2Atomic oxygen and ozone cleaning device having a temperature control apparatusAPPLIED MATERIALS INC·Filed 2021·Granted Apr 23, 2024·0 cites·13 claims
- 0562US10933624B2Photomask pellicle glue residue removalAPPLIED MATERIALS INC·Filed 2020·Granted Mar 2, 2021·0 cites·20 claims
- 0659US10962889B2Method and apparatus for high throughput photomask curingAPPLIED MATERIALS INC·Filed 2019·Granted Mar 30, 2021·0 cites·20 claims
- 0759US10928724B2Attachment feature removal from photomask in extreme ultraviolet lithography applicationAPPLIED MATERIALS INC·Filed 2019·Granted Feb 23, 2021·0 cites·19 claims
- 0858US10802392B2Photomask laser etchAPPLIED MATERIALS INC·Filed 2019·Granted Oct 13, 2020·0 cites·20 claims
- 0952US11054746B2Portion of layer removal at substrate edgeAPPLIED MATERIALS INC·Filed 2019·Granted Jul 6, 2021·0 cites·20 claims
- 1047US11908679B2Atomic oxygen and ozone device for cleaning and surface treatmentAPPLIED MATERIALS INC·Filed 2019·Granted Feb 20, 2024·0 cites·11 claims
- 1146US2021185793A1Adhesive material removal from photomask in ultraviolet lithography applicationAPPLIED MATERIALS INC·Filed 2019·Application pending·0 cites
- 1243US11467508B2Pellicle adhesive residue removal system and methodsAPPLIED MATERIALS INC·Filed 2019·Granted Oct 11, 2022·0 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →